1-20 of 134
Keywords: Thermal analysis
Close
Sort by
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
Published Online: September 10, 2018
... BT Composite materials PBGA Reliability SMT Thermal analysis Warpage behavior is an important thermal–mechanical characteristic of ball grid array (BGA) devices [ 1 , 2 ]. The mechanism of BGA device warpage is related to the coefficient of thermal expansion (CTE) mismatch between...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2018, 140(4): 040801.
Paper No: EP-17-1128
Published Online: August 20, 2018
.... Syst. , 8 ( 2 ), pp. 711 – 720 10.4271/2015-01-1709 . Power packaging Thermal analysis Worldwide efforts in minimizing CO 2 emissions, resulting from growing concerns about the effects of greenhouse gases on climate, have been a major driver in increasing electrification...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041003.
Paper No: EP-17-1047
Published Online: August 20, 2018
... Reliability Solder Thermal analysis 03 05 2017 16 07 2018 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received May 3, 2017; final manuscript received July 16, 2018; published online August...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041002.
Paper No: EP-18-1007
Published Online: August 3, 2018
... packaging Chip stacking Electrical design Flip chip Micro vias Reliability Thermal analysis Through-silicon via (TSV)-based three-dimensional (3D) integration presents a path toward reduced delay, reduced power consumption, higher performance, smaller packaging size, and heterogeneous...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
Published Online: June 11, 2018
... in conducting heat to the heatsink [ 4 – 6 ]. Composite materials Conductive adhesives Harsh environment Nanotechnolgy Reliability Thermal analysis 15 10 2017 09 04 2018 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
Published Online: May 11, 2018
... 31, 2018; published online May 11, 2018. Assoc. Editor: Baris Dogruoz. 14 09 2017 31 01 2018 3D packaging Dielectrics Microsystems Power packaging Solder Thermal analysis The rapid increase in heat dissipation of next-generation integrated circuits necessitates...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031001.
Paper No: EP-17-1046
Published Online: May 10, 2018
... environment Reliability Thermal analysis Nowadays, application of outdoor electronics in daily life is constantly growing. Its deployment in climatically harsh environment creates a significant challenge for engineers to design reliable and durable electronic devices and systems. As a consequence...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020906.
Paper No: EP-18-1003
Published Online: May 9, 2018
...: Kaushik Mysore. 09 01 2018 12 04 2018 Conformal coatings Electronic Thermal analysis The current performance of supercomputers, power devices, electric vehicles, and advanced military avionics is often limited by the ability to dissipate heat. An enhanced cooling of high...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020901.
Paper No: EP-17-1092
Published Online: May 9, 2018
... manuscript received January 12, 2018; published online May 9, 2018. Assoc. Editor: Reza Khiabani. 20 09 2017 12 01 2018 Composite materials Physics of failure Thermal analysis Thermal interface materials (TIMs) play a crucial role in removing waste heat from the chip...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020902.
Paper No: EP-17-1094
Published Online: May 9, 2018
... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received September 23, 2017; final manuscript received December 4, 2017; published online May 9, 2018. Assoc. Editor: Reza Khiabani. 23 09 2017 04 12 2017 Electronic Thermal analysis Cooling was reported...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021001.
Paper No: EP-17-1126
Published Online: May 9, 2018
... and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received November 30, 2017; final manuscript received February 23, 2018; published online May 9, 2018. Assoc. Editor: Ankur Jain. 30 11 2017 23 02 2018 3D packaging Thermal...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
Published Online: March 2, 2018
.... 27 09 2017 28 12 2017 3D packaging Chip stacking Harsh environment Thermal analysis The adequate selection of the temperature sensor locations within a microchip or a rack of microprocessors may allow a reduction in the number of sensors needed to characterize the thermal...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
Published Online: March 2, 2018
... of failure Power packaging Solder Thermal analysis High-temperature electronics and next generation power electronics operate at temperatures above 200 °C. Conventional Sn based compositions have very high homologous temperatures at these operating conditions which result in rapid microstructural...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
Published Online: March 2, 2018
... Electronic Embedded passives Reliability Telecommunications Thermal analysis Air cooling technologies are becoming increasingly challenged to address the heat dissipation rates and heat densities arising in next-generation electronic systems, with acoustic noise, air-cooling capability, and fan...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010907.
Paper No: EP-17-1109
Published Online: March 2, 2018
.... 13 10 2017 28 11 2017 Thermal analysis A raised floor data center is a facility housing computer systems and associated components. Such facilities are commonly cooled using air supplied by the computer room air handler (CRAH) units to the information technology (IT) equipment...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010904.
Paper No: EP-17-1093
Published Online: March 2, 2018
... basic thermal metamaterial functions to practical electronics applications. Composite materials Electronic PWB Design Thermal analysis 22 09 2017 19 12 2017 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010902.
Paper No: EP-17-1087
Published Online: March 2, 2018
... without overcooling the entire data center. Dynamic local cooling can be achieved by placing actuators to control cooling air delivery as close to the IT equipment as possible. Electronic Failure analysis Thermal analysis 18 09 2017 29 11 2017 Contributed by the Electronic...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041011.
Paper No: EP-17-1021
Published Online: October 27, 2017
..., dual counter rotating, or centrifugal blower type fans as the primary air moving devices within their chassis. Electronic Thermal analysis 16 02 2017 10 10 2017 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E...
Topics: Fans, Temperature
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041012.
Paper No: EP-17-1022
Published Online: October 27, 2017
...% or a corresponding power consumption of 322 TWh [ 3 ]. With this industry continuing to grow and strain the national electricity grid, there is a need to target energy savings within the data center. Electronic Thermal analysis 19 02 2017 21 09 2017 Contributed by the Electronic...