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Keywords: Solder
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020903.
Paper No: EP-20-1081
Published Online: February 22, 2021
...). Fig. 7 Power loss (thermal, blue dotted curve, right axis) and energy-conversion efficiency (black solid line, left axis) of the FCML converter system (Fig. 1 ) as a function of input power with soldered tall MHS. Power loss error bars (right axis) are smaller than the symbols and hence...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
Published Online: September 10, 2018
...Bastian Rheingans; Roman Furrer; Jürg Neuenschwander; Irina Spies; Axel Schumacher; Stephan Knappmann; Lars P. H. Jeurgens; Jolanta Janczak-Rusch Reactive joining, i.e., utilization of an exothermal reaction to locally generate the heat required for soldering or brazing, represents an emerging...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031007.
Paper No: EP-18-1009
Published Online: June 11, 2018
... on interfacial reaction products, i.e., interfacial IMCs. After bumps soldering, a great amount of larger diamond-shaped (Cu, Ni) 6 Sn 5 compounds were densely packed at the edge region, while some smaller ones were only scattered at the center region. Moreover, substantial particle-shaped (Ni, Cu) 3 Sn 4...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031005.
Paper No: EP-17-1107
Published Online: May 21, 2018
...Sinan Su; Nianjun Fu; Francy John Akkara; Sa'd Hamasha Solder joints in electronic assemblies are subjected to mechanical and thermal cycling. These cyclic loadings lead to the fatigue failure of solder joints involving damage accumulation, crack initiation, crack propagation, and failure. Aging...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
Published Online: May 11, 2018
... 31, 2018; published online May 11, 2018. Assoc. Editor: Baris Dogruoz. 14 09 2017 31 01 2018 3D packaging Dielectrics Microsystems Power packaging Solder Thermal analysis The rapid increase in heat dissipation of next-generation integrated circuits necessitates...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020903.
Paper No: EP-17-1100
Published Online: May 9, 2018
... conductivity. TLPS joints formed from sinter pastes consist of metallic particles embedded in matrices of intermetallic compounds (IMCs). Compared to conventional solder attach, TLPS joints consist to a considerably higher percentage of brittle IMCs. This raises the concern that TLPS joints are susceptible...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011002.
Paper No: EP-17-1035
Published Online: March 2, 2018
... silicon and organic printed circuit board (PCB), WLCSP technology still faces reliability challenges, such as the solder joint fragile life issue. In this paper, a new WLCSP design (WLCSP-PN) is proposed, based on the structure of WLCSP with Cu posts (WLCSP-P), to release the stress on the solder joints...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
Published Online: March 2, 2018
...Sandeep Mallampati; Liang Yin; David Shaddock; Harry Schoeller; Junghyun Cho Predominant high melting point solders for high-temperature and harsh environment electronics (operating temperatures from 200 to 250 °C) are Pb-based systems, which are being subjected to RoHS regulations because...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011003.
Paper No: EP-17-1089
Published Online: March 2, 2018
...Y. Tang; S. M. Luo; G. Y. Li; Z. Yang; C. J. Hou The ripening growth kinetics of interfacial Cu 6 Sn 5 grains between Cu substrates and Sn-3.0Ag-0.5Cu-xTiO 2 (x = 0, 0.02, 0.05, 0.1, 0.3, and 0.6 wt %) (SAC305-xTiO 2 ) solders were investigated. The results show that the Cu 6 Sn 5 grain morphology...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031002.
Paper No: EP-16-1064
Published Online: June 14, 2017
... and, finally, by integrating the subgrain-size dependency λ ss . The new model is found to accurately model the creep behavior of lead-free solder alloy by combining the physical state variables. The features of the creep model can be explored further by changing the physical variable such as subgrain size...
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2017, 139(2): 020301.
Paper No: EP-17-1032
Published Online: June 12, 2017
...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011009.
Paper No: EP-16-1045
Published Online: January 27, 2017
... incompatibility between carbon and metals that limits adhesion. Recently, we explored a new technique for electroplating carbon fibers with nickel. Electroplated carbon fiber tows were soldered to nickel metal tabs using SAC 305 (Sn3Ag0.5Cu). The electroplated nickel was found to be free of microvoids with (Ni,Cu...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011004.
Paper No: EP-16-1075
Published Online: December 29, 2016
... is unlimited. 24 06 2016 04 11 2016 Composite materials Conductive adhesives Microsystems Solder Thermal analysis The performance characteristics of TIMs continue to improve rapidly with the development of novel nanostructured materials and advanced manufacturing processes...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041006.
Paper No: EP-16-1095
Published Online: October 10, 2016
... react with Sn to form IMC on the interface. This is an essential requirement of soldering action using Sn-rich solders. Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received August 9, 2016; final...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041005.
Paper No: EP-16-1069
Published Online: October 10, 2016
...Yan Zhu; Fenglian Sun The sandwich structure Cu/Sn/Cu solder joints with different thicknesses of the solder layers ( δ) are fabricated using a reflow solder method. The microstructure and composition of the solder joints are observed and analyzed by scanning electron microscopy (SEM). Results show...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2016, 138(3): 030801.
Paper No: EP-15-1143
Published Online: June 8, 2016
...Subhasis Mukherjee; Mohammed Nuhi; Abhijit Dasgupta; Mohammad Modarres Most solders used in electronic systems have low-melting temperature and hence experience significant amount of creep deformation throughout their life-cycle because typical operational and test conditions represent high...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 020804.
Paper No: EP-16-1006
Published Online: April 21, 2016
... , 1987 , “ Method of Securing Electronic Components to a Substrate ,” U.S. Patent No. US4810672B2. [7] Zuruzi , A. S. , Lahiri , S. K. , Burman , P. , and Siow , K. S. , 2001 , “ Correlation Between Intermetallic Thickness and Roughness During Solder Reflow ,” J. Electron. Mater...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021002.
Paper No: EP-15-1128
Published Online: March 23, 2016
...Sa'd Hamasha; Peter Borgesen The behavior of lead-free solder alloys under realistic service conditions is still not well understood. Life prediction of solder joints relies on conducting accelerated tests and extrapolating results to service conditions. This can be very misleading without proper...