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Keywords: 3D packaging
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011009.
Paper No: EP-19-1058
Published Online: October 10, 2019
.... , Samajdar , I. , Haldar , A. , and Sain , A. , 2013 , “ Micromechanics of Emergent Patterns in Plastic Flows ,” Sci. Rep. , 3 ( 1 ), p. 2728 . 10.1038/srep02728 e-mail:  hzh29@mail.sysu.edu.cn 19 05 2019 14 08 2019 10 10 2019 3D packaging micro...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2018, 140(4): 044502.
Paper No: EP-18-1015
Published Online: August 6, 2018
... of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received February 28, 2018; final manuscript received July 4, 2018; published online August 6, 2018. Assoc. Editor: Jin Yang. 28 02 2018 04 07 2018 3D packaging Bumping Flip chip To meet...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041002.
Paper No: EP-18-1007
Published Online: August 3, 2018
... Method of TSV Interposer for Thermal Analysis in 3D Packages ,” 16th International Conference on Electronic Packaging Technology ( ICEPT ), Wuhan, China, Aug. 16–19, pp. 820 – 823 . 10.1109/ICEPT.2016.7583256 [37] Liu , Z. , Swarup , S. , Tan , S. X.-D. , Chen , H. B. , and Wang...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
Published Online: May 11, 2018
... 31, 2018; published online May 11, 2018. Assoc. Editor: Baris Dogruoz. 14 09 2017 31 01 2018 3D packaging Dielectrics Microsystems Power packaging Solder Thermal analysis The rapid increase in heat dissipation of next-generation integrated circuits necessitates...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031004.
Paper No: EP-17-1127
Published Online: May 11, 2018
... OURNAL OF E LECTRONIC P ACKAGING . Manuscript received December 11, 2017; final manuscript received February 14, 2018; published online May 11, 2018. Assoc. Editor: Yi-Shao Lai. 11 12 2017 14 02 2018 3D packaging Wafer level packaging Wafer scale three-dimensional...
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2018, 140(2): 020301.
Paper No: EP-18-1012
Published Online: May 9, 2018
... would also like to acknowledge InterPACK 2017 General Conference Chair Dr. Mehdi Asheghi and JEP Editor Professor Y. C. Lee for their support and cooperation. 3D packaging Battery technology Harsh environment High density interconnects Microsystems Optoelectronics Power packaging Sensors...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020907.
Paper No: EP-17-1104
Published Online: May 9, 2018
... by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 9, 2017; final manuscript received April 13, 2018; published online May 9, 2018. Assoc. Editor: Kaushik Mysore. 09 10 2017 13 04 2018 3D packaging...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021001.
Paper No: EP-17-1126
Published Online: May 9, 2018
... and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received November 30, 2017; final manuscript received February 23, 2018; published online May 9, 2018. Assoc. Editor: Ankur Jain. 30 11 2017 23 02 2018 3D packaging Thermal...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010905.
Paper No: EP-17-1099
Published Online: March 2, 2018
.... 27 09 2017 28 12 2017 3D packaging Chip stacking Harsh environment Thermal analysis The adequate selection of the temperature sensor locations within a microchip or a rack of microprocessors may allow a reduction in the number of sensors needed to characterize the thermal...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041010.
Paper No: EP-17-1026
Published Online: October 25, 2017
... ACKAGING . Manuscript received March 9, 2017; final manuscript received September 21, 2017; published online October 25, 2017. Assoc. Editor: Kaushik Mysore. 09 03 2017 21 09 2017 3D packaging CSP Flip chip High density interconnects Power packaging Wirebond In general...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041002.
Paper No: EP-17-1042
Published Online: July 27, 2017
... and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received April 13, 2017; final manuscript received July 8, 2017; published online July 27, 2017. Assoc. Editor: Yi-Shao Lai. 13 04 2017 08 07 2017 3D packaging MCM SOC...
Topics: Wire, Deflection
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041001.
Paper No: EP-16-1151
Published Online: July 27, 2017
... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received December 31, 2016; final manuscript received March 28, 2017; published online July 27, 2017. Assoc. Editor: Eric Wong. 31 12 2016 28 03 2017 3D packaging BGA Embedded passives Flip chip Wireless...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031008.
Paper No: EP-17-1023
Published Online: July 10, 2017
... received February 27, 2017; final manuscript received June 21, 2017; published online July 10, 2017. Assoc. Editor: Mehdi Asheghi. 27 02 2017 21 06 2017 3D packaging Electronic Thermal analysis The desire for high computational performances and improved power efficiency...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2017, 139(3): 030801.
Paper No: EP-16-1146
Published Online: June 14, 2017
... OF E LECTRONIC P ACKAGING . Manuscript received December 25, 2016; final manuscript received February 28, 2017; published online June 14, 2017. Assoc. Editor: Satish Chaparala. 25 12 2016 28 02 2017 3D packaging CSP Electronic Flexible circuits MEMS Micro vias PWB...
Topics: Lasers, Packaging
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031004.
Paper No: EP-16-1110
Published Online: June 14, 2017
... of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received October 2, 2016; final manuscript received March 28, 2017; published online June 14, 2017. Assoc. Editor: Kaushik Mysore. 02 10 2016 28 03 2017 3D packaging Area array Chip stacking Failure...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020908.
Paper No: EP-16-1140
Published Online: June 12, 2017
... Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received December 16, 2016; final manuscript received March 27, 2017; published online June 12, 2017. Assoc. Editor: Justin A. Weibel. 16 12 2016 27 03 2017 3D packaging Chip stacking Thermal...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020906.
Paper No: EP-16-1138
Published Online: June 12, 2017
... online June 12, 2017. Assoc. Editor: S. Ravi Annapragada. 14 12 2016 30 03 2017 3D packaging Electrical design Physics of failure Reliability Managing the effects of mechanical stress in silicon chips is a growing challenge—both in order to optimize the device performance...
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2017, 139(2): 020301.
Paper No: EP-17-1032
Published Online: June 12, 2017
...Justin A. Weibel; S. Ravi Annapragada 22 03 2017 31 03 2017 3D packaging Backplanes Chip stacking Failure analysis Flexible circuits Nanotechnolgy Reliability Solder Thermal analysis Underfill Wafer level packaging ASME's International Mechanical Engineering...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020911.
Paper No: EP-16-1144
Published Online: June 12, 2017
... 12 2016 07 04 2017 3D packaging Reliability Thermal analysis In order to improve the performance and to reduce the power consumption of electronic products such as mobile phones and wearable devices, the size of semiconductor devices has been miniaturized continuously...