1-20 of 24
Uncertainty
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric

Victor A. Martinez, Carol Caceres, Alfonso Ortega
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041118.
Paper No: EP-24-1040
https://doi.org/10.1115/1.4066101
Published Online: August 24, 2024
View Article titled, Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric
Open the PDF for Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric in another window
Topics: Temperature, Thermal resistance, Thermocouples, Coolants, Errors, Flow (Dynamics), Heat exchangers, Uncertainty
Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041003.
Paper No: EP-20-1094
https://doi.org/10.1115/1.4052275
Published Online: November 22, 2021
View Article titled, A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
Open the PDF for A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging in another window
Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging
Journal Articles

Coupled Calculations of Data Center Cooling and Power Distribution Systems

Aaron P. Wemhoff, Faisal Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041002.
Paper No: EP-21-1044
https://doi.org/10.1115/1.4052101
Published Online: October 6, 2021
View Article titled, Coupled Calculations of Data Center Cooling and Power Distribution Systems
Open the PDF for Coupled Calculations of Data Center Cooling and Power Distribution Systems in another window
Topics: Cooling, Cooling systems, Data centers, Power systems (Machinery), Stress, Energy efficiency, Electronic systems, Uncertainty
Journal Articles

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Rahul Upreti, Siddarth Chintamani, Sandeep Patil, Ashkan Akbariyeh, Brian H. Dennis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011003.
Paper No: EP-20-1083
https://doi.org/10.1115/1.4050696
Published Online: August 6, 2021
View Article titled, Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package
Open the PDF for Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package in another window
Topics: Ball-Grid-Array packages, Design, Failure, Finite element analysis, Finite element methods, Heat, Probability, Reliability, Temperature, Thermal analysis
Journal Articles

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa

Ki Wook Jung, Eunho Cho, Hyoungsoon Lee, Chirag Kharangate, Feng Zhou, Mehdi Asheghi, Ercan M. Dede, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031117.
Paper No: EP-20-1030
https://doi.org/10.1115/1.4047846
Published Online: August 17, 2020
View Article titled, Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
Open the PDF for Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa in another window
Topics: Flow (Dynamics), Fluids, Heat, Heat flux, Manifolds, Microchannels, Pressure drop, Temperature, Uncertainty, Cooling
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011001.
Paper No: EP-19-1028
https://doi.org/10.1115/1.4043704
Published Online: August 1, 2019
View Article titled, Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development
Open the PDF for Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development in another window
Topics: Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011002.
Paper No: EP-19-1029
https://doi.org/10.1115/1.4044218
Published Online: August 1, 2019
View Article titled, Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model
Open the PDF for Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model in another window
Topics: Corners (Structural elements), Density, Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing, Solder joints
Journal Articles

Error Reduction in Infrared Thermography by Multiframe Super-Resolution

Aditya Chandramohan, Sara K. Lyons, Justin A. Weibel, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041008.
Paper No: EP-18-1028
https://doi.org/10.1115/1.4041360
Published Online: October 1, 2018
View Article titled, Error Reduction in Infrared Thermography by Multiframe Super-Resolution
Open the PDF for Error Reduction in Infrared Thermography by Multiframe Super-Resolution in another window
Topics: Emissivity, Errors, Resolution (Optics), Temperature, Thermography, Uncertainty
Journal Articles

Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

Hamoon Azizsoltani, Achintya Haldar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041003.
Paper No: EP-17-1047
https://doi.org/10.1115/1.4040924
Published Online: August 20, 2018
View Article titled, Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept
Open the PDF for Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept in another window
Topics: Failure, Finite element analysis, Modeling, Reliability, Solders, Thermomechanics, Lead-free solders, Electronic packaging, Uncertainty, Stress
Journal Articles

Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling

Pablo A. de Oliveira, Jader R. Barbosa, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031005.
Paper No: EP-17-1008
https://doi.org/10.1115/1.4036817
Published Online: June 28, 2017
View Article titled, Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling
Open the PDF for Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling in another window
Topics: Compressors, Cooling, Heat, Heat sinks, Heat transfer, Refrigeration, Stress, Temperature, Flow (Dynamics), Refrigerants
Journal Articles

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

Ronald J. Warzoha, Andrew N. Smith, Maurice Harris
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011004.
Paper No: EP-16-1075
https://doi.org/10.1115/1.4035178
Published Online: December 29, 2016
View Article titled, Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument
Open the PDF for Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument in another window
Topics: Heat, Instrumentation, Probes, Resolution (Optics), Steady state, Uncertainty, Heat flux, Measurement uncertainty, Fillers (Materials), Temperature measurement
Journal Articles

Experimental Characterization of Various Cold Aisle Containment Configurations for Data Centers

Vikneshan Sundaralingam, Vaibhav K. Arghode, Yogendra Joshi, Wally Phelps
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011007.
Paper No: EP-13-1052
https://doi.org/10.1115/1.4028520
Published Online: October 7, 2014
View Article titled, Experimental Characterization of Various Cold Aisle Containment Configurations for Data Centers
Open the PDF for Experimental Characterization of Various Cold Aisle Containment Configurations for Data Centers in another window
Topics: Air flow, Containment, Data centers, Flow (Dynamics), Stress, Temperature, Tiles, Uncertainty, Heat
Journal Articles

A Stepped-Bar Apparatus for Thermal Resistance Measurements

Dakotah R. Thompson, Sameer R. Rao, Baratunde A. Cola
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041002.
Paper No: EP-13-1019
https://doi.org/10.1115/1.4025116
Published Online: August 13, 2013
View Article titled, A Stepped-Bar Apparatus for Thermal Resistance Measurements
Open the PDF for A Stepped-Bar Apparatus for Thermal Resistance Measurements in another window
Topics: Heat, Measurement uncertainty, Temperature, Thermal resistance, Thermocouples, Uncertainty, Thermal conductivity, Errors, Design, ASTM International
Journal Articles

Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell

Ethan Cruz, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030904.
Paper No: EP-12-1092
https://doi.org/10.1115/1.4024944
Published Online: July 24, 2013
View Article titled, Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell
Open the PDF for Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell in another window
Topics: Computer simulation, Data centers, Flow (Dynamics), Temperature, Tiles, Turbulence, Computational fluid dynamics, Uncertainty
Journal Articles

Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages

S. Radhakrishnan, G. Subbarayan, L. Nguyen, W. Mazotti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 229–235.
https://doi.org/10.1115/1.2753885
Published Online: October 22, 2006
View Article titled, Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages
Open the PDF for Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages in another window
Topics: Epoxy adhesives, Epoxy resins, Uncertainty, Viscoelasticity, Temperature, Modeling, Lasers, Displacement
Journal Articles

Experimental Measurements of the Flow and Heat Transfer of a Square Jet Impinging on an Array of Square Pin Fins

Johnny S. Issa, Alfonso Ortega
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 61–70.
https://doi.org/10.1115/1.2160513
Published Online: June 14, 2005
View Article titled, Experimental Measurements of the Flow and Heat Transfer of a Square Jet Impinging on an Array of Square Pin Fins
Open the PDF for Experimental Measurements of the Flow and Heat Transfer of a Square Jet Impinging on an Array of Square Pin Fins in another window
Topics: Flow (Dynamics), Heat sinks, Heat transfer, Pressure, Clearances (Engineering), Uncertainty
Journal Articles

A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System

Satish Radhakrishnan, Ganesh Subbarayan, Luu Nguyen, William P. Mazotti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 391–396.
https://doi.org/10.1115/1.2056573
Published Online: December 14, 2004
View Article titled, A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System
Open the PDF for A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System in another window
Topics: Algorithms, Laser beams, Optical fiber, Simulated annealing, Uncertainty, Temperature, Lasers
Journal Articles

Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages

T. Winkler, A. Schubert, E. Kaulfersch, B. Michel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 282–285.
https://doi.org/10.1115/1.2793853
Published Online: December 1, 1999
View Article titled, Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages
Open the PDF for Consideration of Parameter Scattering in Thermo-Mechanical Characterization of Advanced Packages in another window
Topics: Electromagnetic scattering, Thermomechanics, Finite element analysis, Uncertainty, Simulation, Chaos, Electronic packages, Materials properties, Modeling, Optimization
Journal Articles

A Global Multidimensional Sensitivity Analysis of Electronic Systems Subjected to Time-Dependent Excitations

H. A. Jensen, A. O. Cifuentes
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1998, 120(4): 391–394.
https://doi.org/10.1115/1.2792652
Published Online: December 1, 1998
View Article titled, A Global Multidimensional Sensitivity Analysis of Electronic Systems Subjected to Time-Dependent Excitations
Open the PDF for A Global Multidimensional Sensitivity Analysis of Electronic Systems Subjected to Time-Dependent Excitations in another window
Topics: Electronic systems, Excitation, Sensitivity analysis, Design, Dynamic response, Electronic components, Uncertainty
Journal Articles

Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling

Shigekazu Kieda, Noriyuki Ashiwake, Takahiro Daikoku, Shizuo Zushi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 270–275.
https://doi.org/10.1115/1.2909328
Published Online: September 1, 1993
View Article titled, Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling
Open the PDF for Application of Stochastic Finite Element Method to Thermal Analysis for Computer Cooling in another window
Topics: Computer cooling, Finite element methods, Thermal analysis, Computers, Cooling, Heat, Sensitivity analysis, Temperature, Temperature distribution, Thermal properties