1-6 of 6
Thermoreflectance
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm

Daiki Higuma, João Vitor Thomsen Silveira, Byunggi Kim, Masahiro Nomura, Kazuyoshi Fushinobu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041115.
Paper No: EP-24-1015
https://doi.org/10.1115/1.4066086
Published Online: August 17, 2024
View Article titled, Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm
Open the PDF for Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm in another window
Topics: Algorithms, Lasers, Thermal conductivity, Thermal properties, Thermoreflectance, Temperature, Heat, Flow (Dynamics), Thermal resistance, Interfacial thermal resistance
Journal Articles

The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates

Yiwen Song, James Spencer Lundh, Weijie Wang, Jacob H. Leach, Devon Eichfeld, Anusha Krishnan, Carlos Perez, Dong Ji, Trent Borman, Kevin Ferri, Jon-Paul Maria, Srabanti Chowdhury, Jae-Hyun Ryou, Brian M. Foley, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041112.
Paper No: EP-20-1014
https://doi.org/10.1115/1.4047578
Published Online: July 10, 2020
View Article titled, The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates
Open the PDF for The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates in another window
Topics: Gallium nitride, Thermal conductivity, Phonons, Raman spectroscopy, Steady state, Thermoreflectance
Journal Articles

Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics

James Spencer Lundh, Yiwen Song, Bikramjit Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Brianna A. Klein, Dustin Kendig, Hyungtak Kim, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031113.
Paper No: EP-20-1012
https://doi.org/10.1115/1.4047100
Published Online: May 21, 2020
View Article titled, Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics
Open the PDF for Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics in another window
Topics: Dynamics (Mechanics), Electronics, Energy gap, Gallium nitride, Heating, Imaging, Steady state, Temperature, Temperature measurement, Thermal characterization
Journal Articles

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2019, 141(2): 020801.
Paper No: EP-18-1026
https://doi.org/10.1115/1.4041813
Published Online: February 25, 2019
View Article titled, Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications
Open the PDF for Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications in another window
Topics: Energy gap, Gallium nitride, Light-emitting diodes, Photonic equipment, Semiconductors (Materials), Temperature, Temperature measurement, Thermal management, Thermography, Automotive industry
Journal Articles

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Dongliang Zhao, Xin Qian, Xiaokun Gu, Saad Ayub Jajja, Ronggui Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2016, 138(4): 040802.
Paper No: EP-16-1067
https://doi.org/10.1115/1.4034605
Published Online: October 6, 2016
View Article titled, Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials
Open the PDF for Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials in another window
Topics: Temperature, Thermal conductivity, Thin films, Transients (Dynamics), Heat, Steady state, Sensors, Bulk solids, Thermoreflectance, Lasers
Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
https://doi.org/10.1115/1.2993145
Published Online: November 13, 2008
View Article titled, Microscale and Nanoscale Thermal Characterization Techniques
Open the PDF for Microscale and Nanoscale Thermal Characterization Techniques in another window
Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy