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Journal Articles

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

Hisham Abusalma, Hayden Richards, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Jian Yu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041119.
Paper No: EP-24-1050
https://doi.org/10.1115/1.4066320
Published Online: September 12, 2024
View Article titled, Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
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Topics: Aerosols, Cantilevers, Durability, Extruding, Finite element analysis, Silver, Testing, Printing, Shock (Mechanics), Strain gages
Journal Articles

Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

Pradeep Lall, Sabina Bimali, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041116.
Paper No: EP-24-1029
https://doi.org/10.1115/1.4066041
Published Online: August 17, 2024
View Article titled, Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink
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Topics: Circuits, Design, Inks, Printing, Shear (Mechanics), Silver, Sintering, Aerosols, Stress, Water
Journal Articles

Special Issue on InterPACK2022

Jin Yang, Sukwon Choi, Benjamin Leever, Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
https://doi.org/10.1115/1.4063893
Published Online: November 1, 2023
View Article titled, Special Issue on InterPACK2022
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Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion
Journal Articles

Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael H. Azarian, Daniel R. Hines, Siddhartha Das, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041105.
Paper No: EP-23-1012
https://doi.org/10.1115/1.4063541
Published Online: November 1, 2023
View Article titled, Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
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Topics: Aerosols, Failure, Failure mechanisms, Modeling, Reliability, Silver, Temperature, Testing, Circuits, Printing
Journal Articles

The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch

Justin H. Chow, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041104.
Paper No: EP-23-1035
https://doi.org/10.1115/1.4063485
Published Online: October 9, 2023
View Article titled, The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch
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Topics: Inks, Particulate matter, Percolation theory, Resistors, Silver, Modeling
Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031008.
Paper No: EP-22-1082
https://doi.org/10.1115/1.4056992
Published Online: March 8, 2023
View Article titled, Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
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Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure
Journal Articles

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011109.
Paper No: EP-22-1035
https://doi.org/10.1115/1.4056477
Published Online: January 11, 2023
View Article titled, Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
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Topics: Adhesives, Electronics, Reliability, Surface preparation, Temperature, Stress, Inks, Silver
Journal Articles

Mandrel Bend Test of Screen-Printed Silver Conductors

Rui Chen, Justin Chow, Yi Zhou, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031004.
Paper No: EP-22-1072
https://doi.org/10.1115/1.4056530
Published Online: January 11, 2023
View Article titled, Mandrel Bend Test of Screen-Printed Silver Conductors
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Topics: Cycles, Flexible electronics, Silver, Reliability, Inks, Damage, Imaging
Journal Articles

Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density

Haibin Zhang, Quan Sun, Zhidan Sun, Yebo Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021006.
Paper No: EP-22-1017
https://doi.org/10.1115/1.4055469
Published Online: September 28, 2022
View Article titled, Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density
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Topics: Current density, Silver, Wire, Temperature gradient, Electrodiffusion
Journal Articles

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Ved Prakash Sharma, Naresh Varma Datla
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041016.
Paper No: EP-21-1159
https://doi.org/10.1115/1.4054096
Published Online: March 31, 2022
View Article titled, Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints
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Topics: Fracture (Materials), Fracture (Process), Intermetallic compounds, Solder joints, Solders, Tin, Reliability, Fractography, Lead-free solders, Failure
Journal Articles

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021117.
Paper No: EP-21-1066
https://doi.org/10.1115/1.4053766
Published Online: March 11, 2022
View Article titled, Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias
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Topics: Aerosols, Failure, Inks, Printing, Shear (Mechanics), Sintering, Stress, Vehicles, Temperature, Silver
Journal Articles

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Xinyue Wang, Zejun Zeng, Guoqi Zhang, Jing Zhang, Pan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041013.
Paper No: EP-21-1109
https://doi.org/10.1115/1.4053432
Published Online: February 1, 2022
View Article titled, Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes
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Topics: Epoxy resins, Pressure, Silver, Sintering, Temperature, Reliability, Shear strength, Epoxy adhesives, Shear (Mechanics)
Journal Articles

Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling

Fei Qin, Shuai Zhao, Yanwei Dai, Lingyun Liu, Tong An, Pei Chen, Yanpeng Gong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031012.
Paper No: EP-21-1125
https://doi.org/10.1115/1.4053028
Published Online: December 27, 2021
View Article titled, Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling
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Topics: Cycles, Nanoindentation, Silver, Stress, Young's modulus, Stress-strain curves
Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
https://doi.org/10.1115/1.4052246
Published Online: November 22, 2021
View Article titled, Design and Fabrication of Leadless Package Structure for Pressure Sensors
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Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature
Journal Articles

Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review

Satyam Saini, Jimil M. Shah, Pardeep Shahi, Pratik Bansode, Dereje Agonafer, Prabjit Singh, Roger Schmidt, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2022, 144(3): 030801.
Paper No: EP-20-1054
https://doi.org/10.1115/1.4051255
Published Online: September 15, 2021
View Article titled, Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review
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Topics: Contamination, Corrosion, Data centers, Particulate matter, Reliability, Temperature, Copper, Silver, Failure
Journal Articles

Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology

Jerzy Szałapak, Konrad Kiełbasiński, Łucja Dybowska-Sarapuk, Jakub Krzeminski, Marian Teodorczyk, Tomasz Kowaluk, Małgorzata Jakubowska
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2021, 143(3): 034501.
Paper No: EP-20-1091
https://doi.org/10.1115/1.4049240
Published Online: January 19, 2021
View Article titled, Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology
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Topics: Carbon, Carbon nanotubes, Electrical resistivity, Graphene, Nanoparticles, Silver, Thermal conductivity, Temperature, Joining, High temperature
Journal Articles

Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink

Neil Dalal, Yuan Gu, Guang Chen, Daniel R. Hines, Abhijit Dasgupta, Siddhartha Das
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011012.
Paper No: EP-19-1002
https://doi.org/10.1115/1.4044960
Published Online: November 14, 2019
View Article titled, Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink
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Topics: Aerosols, Electrical conductivity, Flow (Dynamics), Gas flow, Inks, Magnification, Nanoparticles, Printing, Silver, Agglomeration (Materials)
Includes: Supplementary data
Journal Articles

Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module

Mei-Chien Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031002.
Paper No: EP-18-1100
https://doi.org/10.1115/1.4042984
Published Online: April 10, 2019
View Article titled, Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module
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Topics: Copper, Silver, Stress, Columns (Structural), Electronics, Sintering, Design
Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041007.
Paper No: EP-18-1041
https://doi.org/10.1115/1.4041014
Published Online: September 10, 2018
View Article titled, Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
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Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress
Journal Articles

Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

Tingting Zhang, Bahgat G. Sammakia, Zhihao Yang, Howard Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
https://doi.org/10.1115/1.4040204
Published Online: June 11, 2018
View Article titled, Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density
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Topics: Composite materials, Copper, Density, Nanocomposites, Packing (Shipments), Packings (Cushioning), Particulate matter, Thermal conductivity, Fillers (Materials), Silver