1-19 of 19
Separation (Technology)
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

P. Tumne, V. Venkatadri, S. Kudtarkar, M. Delaus, D. Santos, R. Havens, K. Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020905.
https://doi.org/10.1115/1.4005906
Published Online: June 11, 2012
View Article titled, Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages
Open the PDF for Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages in another window
Topics: Alloys, Design, Failure, Failure mechanisms, Intermetallic compounds, Reliability, Semiconductor wafers, Solders, Separation (Technology), Shock (Mechanics)
Journal Articles

CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device

Varghese Panthalookaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031007.
https://doi.org/10.1115/1.4002009
Published Online: September 9, 2010
View Article titled, CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device
Open the PDF for CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device in another window
Topics: Computational fluid dynamics, Cooling, Energy dissipation, Flow (Dynamics), Heat, Temperature, Natural convection, MOSFET transistors, Separation (Technology), Optimization
Journal Articles

Steady-State Behavior of a Three-Dimensional Pool-Boiling System

Michel Speetjens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041102.
https://doi.org/10.1115/1.2993147
Published Online: November 13, 2008
View Article titled, Steady-State Behavior of a Three-Dimensional Pool-Boiling System
Open the PDF for Steady-State Behavior of a Three-Dimensional Pool-Boiling System in another window
Topics: Bifurcation, Boiling, Cooling, Fluids, Heat, Heat flux, Pool boiling, Steady state, Temperature, Heat transfer
Journal Articles

Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment

Tunc Icoz, Nitin Verma, Yogesh Jaluria
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 466–478.
https://doi.org/10.1115/1.2353284
Published Online: March 27, 2006
View Article titled, Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment
Open the PDF for Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment in another window
Topics: Cooling, Design, Flow (Dynamics), Heat, Heat transfer, Optimization, Simulation, Computer simulation, Pressure drop, Cooling systems
Journal Articles

Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips

T. Elperin, A. Kornilov, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 317–322.
https://doi.org/10.1115/1.1289635
Published Online: August 9, 1999
View Article titled, Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips
Open the PDF for Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips in another window
Topics: Microcracks, Semiconductor wafers, Separation (Technology), Temperature, Laser beams, Sprays, Elasticity, Stress, Temperature distribution, Relaxation (Physics)
Journal Articles

Natural Convection Cooling of Vertical Rectangular Channels in Air Considering Radiation and Wall Conduction

D. A. Hall, G. C. Vliet, T. L. Bergman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 75–84.
https://doi.org/10.1115/1.2792671
Published Online: June 1, 1999
View Article titled, Natural Convection Cooling of Vertical Rectangular Channels in Air Considering Radiation and Wall Conduction
Open the PDF for Natural Convection Cooling of Vertical Rectangular Channels in Air Considering Radiation and Wall Conduction in another window
Topics: Cooling, Heat conduction, Natural convection, Radiation (Physics), Temperature, Wall temperature, Emissivity, Plates (structures), Separation (Technology), Temperature distribution
Journal Articles

Orifice and Impingement Flow Fields in Confined Jet Impingement

G. K. Morris, S. V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 68–72.
https://doi.org/10.1115/1.2792288
Published Online: March 1, 1998
View Article titled, Orifice and Impingement Flow Fields in Confined Jet Impingement
Open the PDF for Orifice and Impingement Flow Fields in Confined Jet Impingement in another window
Topics: Flow (Dynamics), Pressure drop, Design, Electronic packaging, Flow visualization, Heat transfer, Outflow, Renormalization (Physics), Reynolds number, Separation (Technology)
Journal Articles

Natural Convection Cooling of Multiple Heat Sources in Parallel Open-Top Cavities Filled With a Fluorinert Liquid

M. Behnia, A. A. Dehghan, H. Mishima, W. Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 73–81.
https://doi.org/10.1115/1.2792289
Published Online: March 1, 1998
View Article titled, Natural Convection Cooling of Multiple Heat Sources in Parallel Open-Top Cavities Filled With a Fluorinert Liquid
Open the PDF for Natural Convection Cooling of Multiple Heat Sources in Parallel Open-Top Cavities Filled With a Fluorinert Liquid in another window
Topics: Cavities, Cooling, Heat, Natural convection, Heat transfer, Ceramics, Flow (Dynamics), Electrical wires, Electronic equipment, Heat conduction
Journal Articles

Study of Print Release Process in Solder Paste Printing

C. Sahay, L. M. Head, R. Shereen, P. Dujari, J. H. Constable, G. Westby
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 230–234.
https://doi.org/10.1115/1.2792097
Published Online: September 1, 1995
View Article titled, Study of Print Release Process in Solder Paste Printing
Open the PDF for Study of Print Release Process in Solder Paste Printing in another window
Topics: Printing, Solders, Shear strength, Boundary layers, Density, Dimensions, Reflow soldering, Separation (Technology), Shear (Mechanics), Surface mount technology
Journal Articles

A Micro-Mechanics Investigation on the Bonding Strength of Heteroepitaxical Film or Strip on a Hard Substrate

Y. F. Luo, K. P. Rajurkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 201–207.
https://doi.org/10.1115/1.2792092
Published Online: September 1, 1995
View Article titled, A Micro-Mechanics Investigation on the Bonding Strength of Heteroepitaxical Film or Strip on a Hard Substrate
Open the PDF for A Micro-Mechanics Investigation on the Bonding Strength of Heteroepitaxical Film or Strip on a Hard Substrate in another window
Topics: Bonding, Micromechanics (Engineering), Strips, Separation (Technology), Adhesion, Brittleness, Deformation, Hardening, Heat treating (Metalworking), Manufacturing
Journal Articles

Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors

G. Ganguly, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 147–152.
https://doi.org/10.1115/1.2792082
Published Online: June 1, 1995
View Article titled, Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors
Open the PDF for Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors in another window
Topics: Copper, Damage, Deformation, Failure analysis, Finite element analysis, Fourier series, Manufacturing, Materials properties, Pins (Engineering), Printed circuit boards
Journal Articles

Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack

R. K. Govila, Y.-H. Pao, C. Larner, J. Lau, S. Twerefour, S. Erasmus, S. Dolot
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 184–190.
https://doi.org/10.1115/1.2905684
Published Online: September 1, 1994
View Article titled, Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack
Open the PDF for Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack in another window
Topics: Failure analysis, Solder joints, Water, Solders, Cycles, Crack propagation, Cracking (Materials), Failure, Failure mechanisms, Fatigue damage
Journal Articles

Moire´ Interferometry Analysis of Laser Weld Induced Thermal Strain

V. T. Kowalski, A. S. Voloshin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 177–183.
https://doi.org/10.1115/1.2905683
Published Online: September 1, 1994
View Article titled, Moire´ Interferometry Analysis of Laser Weld Induced Thermal Strain
Open the PDF for Moire´ Interferometry Analysis of Laser Weld Induced Thermal Strain in another window
Topics: Interferometry, Lasers, Welded joints, Diffraction gratings, Image processing, Manufacturing, Plates (structures), Separation (Technology), Thermal stresses, Welding
Journal Articles

Crack Propagation in Solder Joints During Thermal-Mechanical Cycling

Ronald G. Ross, Jr., Liang-chi Wen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 69–75.
https://doi.org/10.1115/1.2905507
Published Online: June 1, 1994
View Article titled, Crack Propagation in Solder Joints During Thermal-Mechanical Cycling
Open the PDF for Crack Propagation in Solder Joints During Thermal-Mechanical Cycling in another window
Topics: Crack propagation, Solder joints, Failure, Creep, Cycles, Finite element analysis, Fracture (Materials), Solders, Computer software, Cracking (Materials)
Journal Articles

Numerical Study of Flow and Heat Transfer for Circular Jet Impingement on the Bottom of a Cylindrical Cavity

S. Gavali, K. Karki, S. Patankar, K. Miura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 292–297.
https://doi.org/10.1115/1.2909331
Published Online: September 1, 1993
View Article titled, Numerical Study of Flow and Heat Transfer for Circular Jet Impingement on the Bottom of a Cylindrical Cavity
Open the PDF for Numerical Study of Flow and Heat Transfer for Circular Jet Impingement on the Bottom of a Cylindrical Cavity in another window
Topics: Cavities, Flow (Dynamics), Heat transfer, Nozzles, Separation (Technology), Disks, Fluids, Reynolds number, Thermal boundary layers
Journal Articles

Planar Liquid Jet Impingement Cooling of Multiple Discrete Heat Sources

D. Schafer, F. P. Incropera, S. Ramadhyani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 359–366.
https://doi.org/10.1115/1.2905421
Published Online: December 1, 1991
View Article titled, Planar Liquid Jet Impingement Cooling of Multiple Discrete Heat Sources
Open the PDF for Planar Liquid Jet Impingement Cooling of Multiple Discrete Heat Sources in another window
Topics: Heat, Impingement cooling, Reynolds number, Boundary layers, Heat transfer, Heat transfer coefficients, Heating, Manifolds, Multi-chip modules, Nozzles
Journal Articles

Fluid Dynamic Characteristics of the Flow Over an Array of Large Roughness Elements

S. V. Garimella, P. A. Eibeck
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 367–373.
https://doi.org/10.1115/1.2905422
Published Online: December 1, 1991
View Article titled, Fluid Dynamic Characteristics of the Flow Over an Array of Large Roughness Elements
Open the PDF for Fluid Dynamic Characteristics of the Flow Over an Array of Large Roughness Elements in another window
Topics: Flow (Dynamics), Fluids, Surface roughness, Cavities, Flow separation, Flow visualization, Laser Doppler anemometry, Reynolds number, Separation (Technology), Shear (Mechanics)
Journal Articles

Heat Transfer Study of Staggered Thin Rectangular Blocks in a Channel Flow

Ching Jen Chen, Ramiro H. Bravo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 294–300.
https://doi.org/10.1115/1.2905409
Published Online: September 1, 1991
View Article titled, Heat Transfer Study of Staggered Thin Rectangular Blocks in a Channel Flow
Open the PDF for Heat Transfer Study of Staggered Thin Rectangular Blocks in a Channel Flow in another window
Topics: Channel flow, Heat transfer, Heat exchangers, Flow (Dynamics), Separation (Technology), Temperature, Computation, Fluid dynamics, Fluids, Numerical analysis
Journal Articles

Isothermal Fatigue of 63Sn-37Pb Solder

E. C. Cutiongco, S. Vaynman, M. E. Fine, D. A. Jeannotte
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 110–114.
https://doi.org/10.1115/1.2904350
Published Online: June 1, 1990
View Article titled, Isothermal Fatigue of 63Sn-37Pb Solder
Open the PDF for Isothermal Fatigue of 63Sn-37Pb Solder in another window
Topics: Fatigue, Solders, Fatigue life, Cycles, Temperature, Tension, Failure, Fracture (Process), Tin, Compressive stress