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Journal Articles

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

Hisham Abusalma, Hayden Richards, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Jian Yu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041119.
Paper No: EP-24-1050
https://doi.org/10.1115/1.4066320
Published Online: September 12, 2024
View Article titled, Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
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Topics: Aerosols, Cantilevers, Durability, Extruding, Finite element analysis, Silver, Testing, Printing, Shock (Mechanics), Strain gages
Journal Articles

Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition

Pradeep Lall, Hyesoo Jang, Curtis Hill
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041114.
Paper No: EP-24-1002
https://doi.org/10.1115/1.4065940
Published Online: August 17, 2024
View Article titled, Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition
Open the PDF for Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition in another window
Topics: Capacitance, Sensors, Temperature, Water, Simulation, Reliability, Printing
Journal Articles

Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

Pradeep Lall, Sabina Bimali, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041116.
Paper No: EP-24-1029
https://doi.org/10.1115/1.4066041
Published Online: August 17, 2024
View Article titled, Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink
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Topics: Circuits, Design, Inks, Printing, Shear (Mechanics), Silver, Sintering, Aerosols, Stress, Water
Journal Articles

Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael H. Azarian, Daniel R. Hines, Siddhartha Das, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041105.
Paper No: EP-23-1012
https://doi.org/10.1115/1.4063541
Published Online: November 1, 2023
View Article titled, Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
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Topics: Aerosols, Failure, Failure mechanisms, Modeling, Reliability, Silver, Temperature, Testing, Circuits, Printing
Journal Articles

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Pradeep Lall, Kartik Goyal, Curtis Hill
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021011.
Paper No: EP-22-1029
https://doi.org/10.1115/1.4055986
Published Online: November 23, 2022
View Article titled, Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization
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Topics: Copper, Sintering, Surface mount devices, Electrical resistivity, Printing, Drops, Electronics
Journal Articles

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021117.
Paper No: EP-21-1066
https://doi.org/10.1115/1.4053766
Published Online: March 11, 2022
View Article titled, Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias
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Topics: Aerosols, Failure, Inks, Printing, Shear (Mechanics), Sintering, Stress, Vehicles, Temperature, Silver
Journal Articles

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Jimmy Chuang, Jin Yang, David Shia, Y. L. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041108.
Paper No: EP-21-1037
https://doi.org/10.1115/1.4052711
Published Online: November 2, 2021
View Article titled, Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies
Open the PDF for Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies in another window
Topics: Boiling, Cooling, Electronic packages, Injection molding, Metals, Printing, Additive manufacturing, Flat heat pipes, Manufacturing
Journal Articles

Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Benjamin Leever, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041003.
Paper No: EP-20-1001
https://doi.org/10.1115/1.4048535
Published Online: October 12, 2020
View Article titled, Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours
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Topics: Aerosols, Electrical resistivity, Failure, Inks, Shear (Mechanics), Sintering, Stress, Temperature, Elastic moduli, Printing
Journal Articles

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Pradeep Lall, Jinesh Narangaparambil, Ben Leever, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031121.
Paper No: EP-20-1008
https://doi.org/10.1115/1.4047844
Published Online: August 7, 2020
View Article titled, Flexure and Twist Test Reliability Assurance of Flexible Electronics
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Topics: Bending (Stress), Cycles, Failure, Reliability, Sintering, Temperature, Inks, Flexible electronics, Testing, Printing
Journal Articles

Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink

Neil Dalal, Yuan Gu, Guang Chen, Daniel R. Hines, Abhijit Dasgupta, Siddhartha Das
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011012.
Paper No: EP-19-1002
https://doi.org/10.1115/1.4044960
Published Online: November 14, 2019
View Article titled, Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink
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Topics: Aerosols, Electrical conductivity, Flow (Dynamics), Gas flow, Inks, Magnification, Nanoparticles, Printing, Silver, Agglomeration (Materials)
Includes: Supplementary data
Journal Articles

Additive-Manufactured Organic Interposers

A. Roshanghias, M. Krivec, J. Bardong, A. Binder
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2020, 142(1): 014501.
Paper No: EP-19-1040
https://doi.org/10.1115/1.4044279
Published Online: September 19, 2019
View Article titled, Additive-Manufactured Organic Interposers
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Topics: Additive manufacturing, Manufacturing, Printing
Journal Articles

Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration

Yuyan Gao, Huanyu Cheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2017, 139(2): 020801.
Paper No: EP-16-1131
https://doi.org/10.1115/1.4036238
Published Online: June 13, 2017
View Article titled, Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration
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Topics: Electronics, Manufacturing, Printing, Biology
Journal Articles

Flexible RFID Tag Inductor Printed by Liquid Metal Ink Printer and Its Characterization

Yunxia Gao, Rui Liu, Xianping Wang, Jing Liu, Qianfeng Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031007.
Paper No: EP-14-1120
https://doi.org/10.1115/1.4034062
Published Online: July 21, 2016
View Article titled, Flexible RFID Tag Inductor Printed by Liquid Metal Ink Printer and Its Characterization
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Topics: Inductors, Inks, Liquid metals, Printing, Shapes
Journal Articles

Introduction for JEP Special Issue on Printed Electronics

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2013, 135(1): 010301.
Paper No: EP-12-1101
https://doi.org/10.1115/1.4023808
Published Online: March 26, 2013
View Article titled, Introduction for JEP Special Issue on Printed Electronics
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Topics: Electronics, Printing
Journal Articles

Preparation of Water-Based Carbon Nanotube Inks and Application in the Inkjet Printing of Carbon Nanotube Gas Sensors

Ziyin Lin, Taoran Le, Xiaojuan Song, Yagang Yao, Zhuo Li, Kyoung-sik Moon, Manos M. Tentzeris, Ching-ping Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011001.
Paper No: EP-11-1098
https://doi.org/10.1115/1.4023758
Published Online: March 26, 2013
View Article titled, Preparation of Water-Based Carbon Nanotube Inks and Application in the Inkjet Printing of Carbon Nanotube Gas Sensors
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Topics: Carbon nanotubes, Inks, Printing, Sensors, Water
Journal Articles

The Standardization of Printable Materials and Direct Writing Systems

Jessica Hoffman, Seyeon Hwang, Ada Ortega, Nam-Soo Kim, Kyoung-sik Moon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011006.
Paper No: EP-12-1027
https://doi.org/10.1115/1.4023809
Published Online: March 26, 2013
View Article titled, The Standardization of Printable Materials and Direct Writing Systems
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Topics: Education, Electronics, Inks, Printing
Journal Articles

Inkjet Printing of Radio Frequency Electronics: Design Methodologies and Application of Novel Nanotechnologies

Taoran Le, Ziyin Lin, Rushi Vyas, Vasileios Lakafosis, Li Yang, Anya Traille, Manos M. Tentzeris, Ching-ping Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011007.
Paper No: EP-12-1030
https://doi.org/10.1115/1.4023671
Published Online: March 26, 2013
View Article titled, Inkjet Printing of Radio Frequency Electronics: Design Methodologies and Application of Novel Nanotechnologies
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Topics: Printing, Sensors, Inks, Single-walled carbon nanotubes, Electronics
Journal Articles

Statistical Manufacturing Model of Printing Technology

Nam-Soo Kim, Sarah Luna, Jung-Hyou Lee, Tae-Eui Jeong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011004.
Paper No: EP-12-1005
https://doi.org/10.1115/1.4007450
Published Online: February 26, 2013
View Article titled, Statistical Manufacturing Model of Printing Technology
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Topics: Packing (Shipments), Packings (Cushioning), Particulate matter, Printing, Computer simulation, Manufacturing, Inks, Particle size
Journal Articles

Characterization of the Solder Paste Release From Small Stencil Apertures in the Stencil Printing Process

Srinivasa Aravamudhan, Daryl Santos, Gerald Pham-Van-Diep, Frank Andres
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 340–352.
https://doi.org/10.1115/1.1938208
Published Online: December 10, 2004
View Article titled, Characterization of the Solder Paste Release From Small Stencil Apertures in the Stencil Printing Process
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Topics: Printing, Solders
Journal Articles

Open Defects in PBGA Assembly Solder Joints

S. H. Fan, Y. C. Chan, J. K. L. Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
https://doi.org/10.1115/1.1536951
Published Online: March 14, 2003
View Article titled, Open Defects in PBGA Assembly Solder Joints
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Topics: Manufacturing, Solder joints, Solders, Soldering, Inspection, Thermal stability, Wetting, Printing