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Journal Articles

Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

Tingting Zhang, Bahgat G. Sammakia, Zhihao Yang, Howard Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
https://doi.org/10.1115/1.4040204
Published Online: June 11, 2018
View Article titled, Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density
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Topics: Composite materials, Copper, Density, Nanocomposites, Packing (Shipments), Packings (Cushioning), Particulate matter, Thermal conductivity, Fillers (Materials), Silver
Journal Articles

Design of Thermoelectric Modules for High Heat Flux Cooling

Ram Ranjan, Joseph E. Turney, Charles E. Lents, Virginia H. Faustino
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041001.
Paper No: EP-13-1073
https://doi.org/10.1115/1.4028118
Published Online: September 19, 2014
View Article titled, Design of Thermoelectric Modules for High Heat Flux Cooling
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Topics: Cooling, Design, Heat, Heat flux, Packing (Shipments), Packings (Cushioning), Temperature, Geometry, Thermal resistance, Thermoelectric coolers
Journal Articles

Computational Monolayer for Tertiary Nanoparticles Using Supercomputer

Kyungdeok Jang, Nubia Zuverza, Tae Eui Jeong, Sung Suk Kim, Nam Soo Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011003.
Paper No: EP-12-1004
https://doi.org/10.1115/1.4023527
Published Online: March 26, 2013
View Article titled, Computational Monolayer for Tertiary Nanoparticles Using Supercomputer
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Topics: Packing (Shipments), Packings (Cushioning), Particulate matter, Simulation, Computers, Nanoparticles
Journal Articles

Statistical Manufacturing Model of Printing Technology

Nam-Soo Kim, Sarah Luna, Jung-Hyou Lee, Tae-Eui Jeong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011004.
Paper No: EP-12-1005
https://doi.org/10.1115/1.4007450
Published Online: February 26, 2013
View Article titled, Statistical Manufacturing Model of Printing Technology
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Topics: Packing (Shipments), Packings (Cushioning), Particulate matter, Printing, Computer simulation, Manufacturing, Inks, Particle size
Journal Articles

Thermal Management of a High Packing Density Array of Power Amplifiers Using Liquid Cooling

Z. A. Williams, J. A. Roux
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 488–495.
https://doi.org/10.1115/1.2804100
Published Online: April 19, 2007
View Article titled, Thermal Management of a High Packing Density Array of Power Amplifiers Using Liquid Cooling
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Topics: Computational fluid dynamics, Cooling, Copper, Fins, Temperature, Thermal management, Water, Graphite, Flow (Dynamics), Density
Journal Articles

Graphite Foam Thermal Management of a High Packing Density Array of Power Amplifiers

Z. A. Williams, J. A. Roux
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 456–465.
https://doi.org/10.1115/1.2353282
Published Online: December 23, 2005
View Article titled, Graphite Foam Thermal Management of a High Packing Density Array of Power Amplifiers
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Topics: Cooling, Flow (Dynamics), Graphite, Thermal management, Temperature, Copper, Density, Packing (Shipments), Packings (Cushioning)
Journal Articles

Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

Sejin Han, K. K. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 20–27.
https://doi.org/10.1115/1.483127
Published Online: August 17, 1999
View Article titled, Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation
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Topics: Cavities, Flow (Dynamics), Hardening (Curing), Molding, Packing (Shipments), Packings (Cushioning), Pressure, Semiconductors (Materials), Temperature, Viscosity