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Journal Articles

Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031010.
Paper No: EP-18-1096
https://doi.org/10.1115/1.4043479
Published Online: May 24, 2019
View Article titled, Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems
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Topics: Sensors, Circuits, Impact testing, Vibration, Polarization (Electricity), Polarization (Light), Polarization (Waves), Reflow soldering
Journal Articles

Phenomenological Modeling of Carpeted Surface for Drop Simulation of Portable Electronics

Abhi Sirimamilla, Hua Ye, Yinan Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021006.
Paper No: EP-17-1114
https://doi.org/10.1115/1.4042978
Published Online: April 10, 2019
View Article titled, Phenomenological Modeling of Carpeted Surface for Drop Simulation of Portable Electronics
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Topics: Damping, Electronics, Modeling, Simulation, Impact testing
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Article titled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Finite Element Analysis for Shock Resistance Evaluation of Cushion-Packaged Multifunction Printer Considering Internal Modules

Se-Chang Kim, Dae-Geun Cho, Tae-Gyu Kim, Se-Hun Jung, Ja-Choon Koo, Moon-Ki Kim, Jae-Boong Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041001.
Paper No: EP-13-1004
https://doi.org/10.1115/1.4024748
Published Online: August 7, 2013
View Article titled, Finite Element Analysis for Shock Resistance Evaluation of Cushion-Packaged Multifunction Printer Considering Internal Modules
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Topics: Finite element analysis, Finite element model, Shock (Mechanics), Impact testing, Packaging
Journal Articles

Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements

J. J. M. Zaal, W. D. van Driel, F. J. H. G. Kessels, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011007.
https://doi.org/10.1115/1.3068311
Published Online: February 12, 2009
View Article titled, Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements
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Topics: Impact testing, Reliability, Simulation, Solders, Testing, Deflection, Damping
Journal Articles

Design Guideline for Ball Impact Test Apparatus

Chang-Lin Yeh, Yi-Shao Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 98–104.
https://doi.org/10.1115/1.2429716
Published Online: April 18, 2006
View Article titled, Design Guideline for Ball Impact Test Apparatus
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Topics: Brittleness, Design, Fracture (Process), Impact testing, Reliability, Solder joints, Transients (Dynamics), Damping, Structural dynamics
Journal Articles

Dynamics Of Board-Level Drop Impact

E. H. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 200–207.
https://doi.org/10.1115/1.1938987
Published Online: July 17, 2004
View Article titled, Dynamics Of Board-Level Drop Impact
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Topics: Corners (Structural elements), Deflection, Dynamics (Mechanics), Finite element analysis, Springs, Stress, Electronic packaging, Impact testing
Journal Articles

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
https://doi.org/10.1115/1.1534842
Published Online: March 14, 2003
View Article titled, Impact Resistance of SM Joints Formed With ICA
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Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Shear (Mechanics), Shear strength, Solders, Silver, Resistors, Alloys
Journal Articles

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
https://doi.org/10.1115/1.1502666
Published Online: December 12, 2002
View Article titled, Impact Resistance of SM Joints Formed With ICA
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Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Reliability, Shear (Mechanics), Shear strength, Solders, Silver, Resistors