Page 1 | Search Results | J. Electron. Packag.

1-4 of 4

Sort by

Sort Order Select

Journal Articles

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald

Publisher: ASME

J. Electron. Packag. March 2016, 138(1): 010903.

Paper No: EP-15-1083

https://doi.org/10.1115/1.4032345

Published Online: March 10, 2016

View Article titled, A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Topics: Calibration, Condensers (steam plant), Copper, Flat heat pipes, Heat, Heat losses, Natural convection, Temperature, Thermal resistance, Vapors

Journal Articles

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Mahmood R. S. Shirazy, Luc G. Fréchette

Publisher: ASME

J. Electron. Packag. December 2014, 136(4): 041003.

Paper No: EP-13-1098

https://doi.org/10.1115/1.4026353

Published Online: September 19, 2014

View Article titled, Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Topics: Containers, Copper, Evaporation, Flux (Metallurgy), Foams (Chemistry), Heat, Heat losses, Porosity, Temperature, Ethanol

Journal Articles

Effect of Variable Heat Transfer Coefficient, Fin Geometry, and Curvature on the Thermal Performance of Extended Surfaces

A. G. Agwu Nnanna, A. Haji-Sheikh ,, ASME Fellow, D. Agonafer,, ASME Fellow

Publisher: ASME

J. Electron. Packag. September 2003, 125(3): 456–460.

https://doi.org/10.1115/1.1602711

Published Online: September 17, 2003

View Article titled, Effect of Variable Heat Transfer Coefficient, Fin Geometry, and Curvature on the Thermal Performance of Extended Surfaces

Topics: Geometry, Heat losses, Heat transfer, Heat transfer coefficients, Temperature distribution, Temperature, Fins

Journal Articles

Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module

C. Beckermann, T. F. Smith, B. Pospichal

Publisher: ASME

J. Electron. Packag. June 1994, 116(2): 126–133.

https://doi.org/10.1115/1.2905500

Published Online: June 1, 1994

View Article titled, Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module

Topics: Simulation models, Thermal analysis, Heat transfer, Radiation (Physics), Air flow, Convection, Drag (Fluid dynamics), Geometry, Heat conduction, Heat losses

Journal citation

NARROW

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Effect of Variable Heat Transfer Coefficient, Fin Geometry, and Curvature on the Thermal Performance of Extended Surfaces

Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Effect of Variable Heat Transfer Coefficient, Fin Geometry, and Curvature on the Thermal Performance of Extended Surfaces

Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only