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Volume 137, Issue 4

December 2015

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Review Article
Research Papers
Technical Brief

Review Article

A Brief Overview of Recent Developments in Thermal Management in Data Centers

Sami Alkharabsheh, John Fernandes, Betsegaw Gebrehiwot, Dereje Agonafer, Kanad Ghose, Alfonso Ortega, Yogendra Joshi, Bahgat Sammakia

J. Electron. Packag. December 2015, 137(4): 040801. doi: https://doi.org/10.1115/1.4031326

Abstract

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Topics: Computational fluid dynamics , Cooling , Data centers , Modeling , Temperature , Tiles , Thermal management

A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

Craig Green, Peter Kottke, Xuefei Han, Casey Woodrum, Thomas Sarvey, Pouya Asrar, Xuchen Zhang, Yogendra Joshi, Andrei Fedorov, Suresh Sitaraman, Muhannad Bakir

J. Electron. Packag. December 2015, 137(4): 040802. doi: https://doi.org/10.1115/1.4031481

Abstract

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Topics: Coolants , Cooling , Design , Flow (Dynamics) , Fluids , Heat sinks , Heat , Flux (Metallurgy) , Temperature , Pressure

Nanothermal Interface Materials: Technology Review and Recent Results

Avram Bar-Cohen, Kaiser Matin, Sreekant Narumanchi

J. Electron. Packag. December 2015, 137(4): 040803. doi: https://doi.org/10.1115/1.4031602

Abstract

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Topics: Copper , Cycles , Electrical resistivity , Solders , Teams , Temperature , Testing , Thermal resistance , Bonding , Accelerated life testing

Research Papers

Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications

Erdal Uzunlar, Paul A. Kohl

J. Electron. Packag. December 2015, 137(4): 041001. doi: https://doi.org/10.1115/1.4030952

Abstract

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Topics: MEMS packaging , Microelectromechanical systems , Polymers , Temperature , Semiconductor wafers , Reactive-ion etching , Nuclear magnetic resonance , Hardening (Curing)

Measurement of Air Flow Rate Sensitivity to the Differential Pressure Across a Server Rack in a Data Center

Vaibhav K. Arghode, Yogendra Joshi

J. Electron. Packag. December 2015, 137(4): 041002. doi: https://doi.org/10.1115/1.4031079

Abstract

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Topics: Air flow , Pressure , Server racks , Data centers

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

Soud Farhan Choudhury, Leila Ladani

J. Electron. Packag. December 2015, 137(4): 041003. doi: https://doi.org/10.1115/1.4031523

Abstract

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Topics: Cycles , Fatigue life , Finite element analysis , Solders , Stress , Thermomechanics , Geometry , Reliability , Integrated circuits , Intermetallic compounds

Multiple Quality Characteristics Optimization of Ball Grid Array Wire Bonding Process

Tzeng Yih-Fong, Chen Fu-Chen, Chen Chih-Huang

J. Electron. Packag. December 2015, 137(4): 041004. doi: https://doi.org/10.1115/1.4031471

Abstract

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Topics: Ball-Grid-Array packaging , Optimization , Principal component analysis , Shear strength , Wire , Wire bonding , Design , Performance evaluation , Process design

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Wei Chen, Anirudh Bhat, Suresh K. Sitaraman

J. Electron. Packag. December 2015, 137(4): 041005. doi: https://doi.org/10.1115/1.4031680

Abstract

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Topics: Displacement , Manufacturing , Polymers , Simulation , Testing , Accelerometers , Engineering simulation , Strain gages , Finite element analysis , Engineering prototypes

Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode Systems

Enes Tamdogan, Mehmet Arik

J. Electron. Packag. December 2015, 137(4): 041006. doi: https://doi.org/10.1115/1.4031480

Abstract

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Topics: Cooling , Heat transfer , Light-emitting diodes , Natural convection , Silicones , Heat conduction , Convection , Fluids , Domes (Structural elements) , Coolants