Topics: Computational fluid dynamics , Electronic packages , Flow (Dynamics) , Junctions , Simulation , Temperature , Heat transfer , Computation , Heat , Boundary-value problems

A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints

D. Bhate, D. Chan, G. Subbarayan, L. Nguyen

J. Electron. Packag. June 2008, 130(2): 021003. doi: https://doi.org/10.1115/1.2840057

Abstract

View articletitled, A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints

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Topics: Fatigue , Fatigue cracks , Fracture (Materials) , Fracture mechanics , Modeling , Solder joints , Solders , Tin , Damage , Creep

Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

K. Lafdi, O. Mesalhy, A. Elgafy

J. Electron. Packag. June 2008, 130(2): 021004. doi: https://doi.org/10.1115/1.2912185

Abstract

View articletitled, Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

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Topics: Cooling , Design , Fins , Heat , Heat sinks , Phase change materials , Porosity , Shapes , Temperature , Thermal conductivity

Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect

Cheng Lin, Fangang Tseng, Ching-Chang Chieng

J. Electron. Packag. June 2008, 130(2): 021005. doi: https://doi.org/10.1115/1.2912216

Abstract

View articletitled, Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect

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Topics: Lubricants , Self-assembly , Water , Solders , Adhesives , Manufacturing

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Melida Chin, S. Jack Hu, James R. Barber

J. Electron. Packag. June 2008, 130(2): 021006. doi: https://doi.org/10.1115/1.2912180

Abstract

View articletitled, Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

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Topics: Adhesion , Adhesives , Anisotropy , Bonding , Contact resistance , Delamination , Design , Elastic moduli , Particulate matter , Resins

Board Level Drop Test Analysis Based on Modal Test and Simulation

Fang Liu, Guang Meng, Mei Zhao, Junfeng Zhao

J. Electron. Packag. June 2008, 130(2): 021007. doi: https://doi.org/10.1115/1.2912212

Abstract

View articletitled, Board Level Drop Test Analysis Based on Modal Test and Simulation

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Topics: Elastic moduli , Simulation , Printed circuit board assemblies , Damping , Design , Boundary-value problems

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue

J. Electron. Packag. June 2008, 130(2): 021008. doi: https://doi.org/10.1115/1.2912188

Abstract

View articletitled, On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

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Topics: Damage , Failure , Failure mechanisms , Flip-chip devices , High cycle fatigue , Power density , Solders , Stress , Thermal expansion , Wave motion

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue

J. Electron. Packag. June 2008, 130(2): 021009. doi: https://doi.org/10.1115/1.2912209

Abstract

View articletitled, On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

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Topics: Damage , Epoxy resins , Failure mechanisms , Flip-chip , Flip-chip devices , Reliability , Solder joints , Solders , Viscoelasticity , Waves

Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load

Yan Zhang, Johan Liu, Ragnar Larsson

J. Electron. Packag. June 2008, 130(2): 021010. doi: https://doi.org/10.1115/1.2912183

Abstract

View articletitled, Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load

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Topics: Ball-Grid-Array packaging , Computer simulation , Deformation , Diffraction patterns , Displacement , Interferometers , Modeling , Solders , Stress , Manufacturing

Thermal Conduction Switch for Thermal Management of Chip Scale Atomic Clocks (IMECE2006-14540)

A. D. Laws, Y. J. Chang, V. M. Bright, Y. C. Lee

J. Electron. Packag. June 2008, 130(2): 021011. doi: https://doi.org/10.1115/1.2912187

Abstract

View articletitled, Thermal Conduction Switch for Thermal Management of Chip Scale Atomic Clocks (IMECE2006-14540)

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Topics: Atomic clocks , Disks , Heat conduction , Switches , Temperature , Thermal management , Finite element analysis , Heat , Vehicles

Technical Briefs

Improved Method of $C O_{2}$ Laser Cutting of Aluminum Nitride

Raathai Molian, Pranav Shrotriya, Pal Molian

J. Electron. Packag. June 2008, 130(2): 024501. doi: https://doi.org/10.1115/1.2912223

Abstract

View articletitled, Improved Method of <span class="inline-formula no-formula-id"><span class="mathFormula"></span><math xmlns="http://www.w3.org/1998/Math/MathML"><mrow xmlns=""><mi mathvariant="normal">C</mi><msub><mi mathvariant="normal">O</mi><mn>2</mn></msub></mrow></math></span> Laser Cutting of Aluminum Nitride

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Topics: Aluminum , Cutting , Fracture (Materials) , Laser cutting , Lasers , Thermal stresses , Fracture (Process) , Oxygen , Stress

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Samson Yoon, Changsoo Jang, Bongtae Han

J. Electron. Packag. June 2008, 130(2): 024502. doi: https://doi.org/10.1115/1.2912181

Abstract

View articletitled, Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

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Topics: Diffusion (Physics) , Finite element analysis , Heat transfer , Modeling , Semiconductors (Materials) , Stress , Stress analysis (Engineering) , Temperature , Deformation , Thermal expansion

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Research Papers

Modeling of Resin Flow in Reinforced Dielectric Prepregs

Integrating Compact Thermal Models in CFD Simulations of Electronic Packages

A Nonlinear Fracture Mechanics Approach to Modeling Fatigue Crack Growth in Solder Joints

Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Board Level Drop Test Analysis Based on Modal Test and Simulation

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials

Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load

Thermal Conduction Switch for Thermal Management of Chip Scale Atomic Clocks (IMECE2006-14540)

Technical Briefs

Improved Method of $C O_{2}$ Laser Cutting of Aluminum Nitride

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

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