Skip Nav Destination
Issues
March 2008
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method
J. Electron. Packag. March 2008, 130(1): 011001.
doi: https://doi.org/10.1115/1.2837508
Topics:
Creep
,
Lead-free solders
,
Semiconductor wafers
,
Shear (Mechanics)
,
Solder joints
,
Taguchi methods
,
Temperature
,
Solders
,
Low temperature
Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder
J. Electron. Packag. March 2008, 130(1): 011002.
doi: https://doi.org/10.1115/1.2837513
Topics:
Constitutive equations
,
Creep
,
Damage
,
Finite element analysis
,
Plasticity
,
Simulation
,
Solders
,
Temperature
,
Stress
,
Fatigue
Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects
J. Electron. Packag. March 2008, 130(1): 011003.
doi: https://doi.org/10.1115/1.2837515
Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem
J. Electron. Packag. March 2008, 130(1): 011004.
doi: https://doi.org/10.1115/1.2837521
Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB
J. Electron. Packag. March 2008, 130(1): 011005.
doi: https://doi.org/10.1115/1.2837522
Topics:
Flip-chip
,
Flip-chip devices
,
Reliability
,
Solder joints
,
Solders
,
Tin
,
Solder masks
,
Failure
,
Fracture (Materials)
,
Cycles
Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection
J. Electron. Packag. March 2008, 130(1): 011006.
doi: https://doi.org/10.1115/1.2837524
Investigation of Microporous Coatings and Mesoscale Evaporator Enhancements for Two-Phase Cooling of Electronic Components
J. Electron. Packag. March 2008, 130(1): 011007.
doi: https://doi.org/10.1115/1.2837509
Topics:
Boiling
,
Coatings
,
Cooling
,
Heat
,
Fluids
,
Fins
,
Heat conduction
,
Coating processes
Damage Initiation and Propagation in Voided Joints: Modeling and Experiment
J. Electron. Packag. March 2008, 130(1): 011008.
doi: https://doi.org/10.1115/1.2837562
Topics:
Damage
,
Finite element analysis
,
Modeling
,
Solders
,
Durability
,
Solder joints
,
Creep
Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering
J. Electron. Packag. March 2008, 130(1): 011009.
doi: https://doi.org/10.1115/1.2837518
Topics:
Fibers
,
Solder joints
,
Soldering
,
Solders
,
Surface tension
,
Geometry
,
Shapes
,
Equilibrium (Physics)
,
Yaw
Boiling of Water at Subatmospheric Conditions With Enhanced Structures: Effect of Liquid Fill Volume
J. Electron. Packag. March 2008, 130(1): 011010.
doi: https://doi.org/10.1115/1.2837523
Wiresweep Reduction via Direct Cavity Injection During Encapsulation of Stacked Chip-Scale Packages
J. Electron. Packag. March 2008, 130(1): 011011.
doi: https://doi.org/10.1115/1.2837561
Topics:
Cavities
,
Compression
,
Flow (Dynamics)
,
Wire
,
Packaging
,
Stress
,
Vehicles
,
Deformation
,
Bonding
Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package
J. Electron. Packag. March 2008, 130(1): 011012.
doi: https://doi.org/10.1115/1.2837520
Topics:
Ceramics
,
Failure
,
Fatigue life
,
Solder joints
,
Solders
,
Vibration
,
Stress
,
Cycles
,
Vehicles
,
Finite element model
Email alerts
RSS Feeds
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
J. Electron. Packag (March 2025)
