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Issues
September 2003
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Technical Papers
Analysis of Substrates for Single Emitter Laser Diodes
J. Electron. Packag. September 2003, 125(3): 313–318.
doi: https://doi.org/10.1115/1.1527657
Topics:
Lasers
,
Stress
,
Bonding
,
Thermal conductivity
,
Ceramics
,
Temperature
,
Gallium arsenide
Compact Modeling of Forced Flow in Longitudinal Fin Heat Sinks With Tip Bypass
J. Electron. Packag. September 2003, 125(3): 319–324.
doi: https://doi.org/10.1115/1.1533803
Topics:
Flow (Dynamics)
,
Heat sinks
,
Computational fluid dynamics
Packaging of Optical MEMS Devices
Yee L. Low, Ronald E. Scotti, David A. Ramsey, Cristian A. Bolle, Steven P. O’Neill, Khanh C. Nguyen
J. Electron. Packag. September 2003, 125(3): 325–328.
doi: https://doi.org/10.1115/1.1535933
Topics:
Ceramics
,
Microelectromechanical systems
,
Packaging
,
Thin films
Simulation of Void Growth in Molten Solder Bumps
J. Electron. Packag. September 2003, 125(3): 329–334.
doi: https://doi.org/10.1115/1.1569954
Topics:
Bubbles
,
Melting
,
Solders
,
Flow (Dynamics)
,
Surface tension
,
Viscosity
,
Temperature
Modeling the Thermal Behavior of Solder Paste Inside Reflow Ovens
J. Electron. Packag. September 2003, 125(3): 335–346.
doi: https://doi.org/10.1115/1.1569955
Topics:
Ovens
,
Solders
,
Temperature
,
Weight (Mass)
,
Modeling
,
Heat transfer
,
Heating
,
Cooling
,
Temperature profiles
,
Melting
Simplification of Finite Element Models for Thermal Fatigue Life Prediction of PBGA Packages
Hasan U. Akay, Professor and Chair, Mem. ASME, Yan Liu, Research Assistant, Mostafa Rassaian, Technical Fellow, Mem. ASME,
J. Electron. Packag. September 2003, 125(3): 347–353.
doi: https://doi.org/10.1115/1.1569956
Topics:
Fatigue life
,
Finite element model
,
Solder joints
,
Fatigue
Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena
J. Electron. Packag. September 2003, 125(3): 354–361.
doi: https://doi.org/10.1115/1.1572903
Topics:
Heat transfer
,
Jets
,
Temperature
,
Capacitance
,
Reynolds number
Local Heat Transfer Characteristics in Simulated Electronic Modules
J. Electron. Packag. September 2003, 125(3): 362–368.
doi: https://doi.org/10.1115/1.1602478
Topics:
Generators
,
Heat transfer
,
Vortices
,
Flow (Dynamics)
,
Heat transfer coefficients
,
Wakes
,
Forced convection
Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities
J. Electron. Packag. September 2003, 125(3): 369–377.
doi: https://doi.org/10.1115/1.1602702
A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology
J. Electron. Packag. September 2003, 125(3): 378–385.
doi: https://doi.org/10.1115/1.1602479
Topics:
Cooling
,
Heat
,
Heat conduction
,
Heat pipes
,
Modeling
,
Temperature
,
Thermal conductivity
,
Vapors
,
Design
,
Heat sinks
Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction
J. Electron. Packag. September 2003, 125(3): 386–391.
doi: https://doi.org/10.1115/1.1602703
Failure Analysis of Full Delamination on the Stacked Die Leaded Packages
J. Electron. Packag. September 2003, 125(3): 392–399.
doi: https://doi.org/10.1115/1.1602704
Topics:
Delamination
,
Finite element analysis
,
Stress concentration
,
Failure analysis
,
Adhesion
Interfacial Stress Analysis and Fracture of a Bi-Material Strip With a Heterogeneous Underfill
J. Electron. Packag. September 2003, 125(3): 400–413.
doi: https://doi.org/10.1115/1.1602480
Topics:
Particulate matter
,
Stress
,
Fracture (Materials)
,
Fracture (Process)
,
Strips
Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages
J. Electron. Packag. September 2003, 125(3): 414–419.
doi: https://doi.org/10.1115/1.1602705
Topics:
Deflection
,
Temperature
,
Finite element methods
,
Plates (structures)
Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading
J. Electron. Packag. September 2003, 125(3): 420–425.
doi: https://doi.org/10.1115/1.1602706
Topics:
Delamination
,
Fracture (Process)
,
Resins
,
Temperature
,
Copper alloys
,
Fracture mechanics
,
Alloys
,
Radioactive tracers
,
Wedges
,
Cracking (Materials)
Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation
J. Electron. Packag. September 2003, 125(3): 426–430.
doi: https://doi.org/10.1115/1.1602707
Pumpless Loop for Narrow Channel and Micro-Channel Boiling
J. Electron. Packag. September 2003, 125(3): 431–441.
doi: https://doi.org/10.1115/1.1602708
Topics:
Boilers
,
Boiling
,
Cooling
,
Critical heat flux
,
Flow (Dynamics)
,
Pressure drop
,
Water
,
Coolants
,
Heat
,
Temperature
Comparison Between the Standard and Staggered Layout for Cooling Fins in Forced Convection Cooling
J. Electron. Packag. September 2003, 125(3): 442–446.
doi: https://doi.org/10.1115/1.1602709
Topics:
Cooling
,
Fins
,
Flow (Dynamics)
,
Pressure drop
,
Heat
,
Heat transfer
,
Heat sinks
,
Coolants
,
Forced convection
Prediction of Thermal Performance of Wire-Bonded Plastic Ball Grid Array Package for Underhood Automotive Applications
J. Electron. Packag. September 2003, 125(3): 447–455.
doi: https://doi.org/10.1115/1.1602710
Topics:
Junctions
,
Molding
,
Printed circuit boards
,
Temperature
,
Thermal conductivity
,
Natural convection
,
Wire
,
Automotive industry
,
Emissivity
Effect of Variable Heat Transfer Coefficient, Fin Geometry, and Curvature on the Thermal Performance of Extended Surfaces
J. Electron. Packag. September 2003, 125(3): 456–460.
doi: https://doi.org/10.1115/1.1602711
Topics:
Geometry
,
Heat losses
,
Heat transfer
,
Heat transfer coefficients
,
Temperature distribution
,
Temperature
,
Fins
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