Topics: Die cutting , Lamination , Reliability , Shearing (Deformation) , Solder joints , Fatigue life , Shear (Mechanics) , Silicon , Stress , Temperature

Thermal Enhancement Coatings for Microelectronic Systems

L. S. Fletcher, M. A. Lambert, E. E. Marotta

J. Electron. Packag. September 1998, 120(3): 229–237. doi: https://doi.org/10.1115/1.2792627

Abstract

View articletitled, Thermal Enhancement Coatings for Microelectronic Systems

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Topics: Coatings , Electronic components , Failure , Heat

Avionics Passive Cooling With Microencapsulated Phase Change Materials

A. J. Fossett, M. T. Maguire, A. A. Kudirka, F. E. Mills, D. A. Brown

J. Electron. Packag. September 1998, 120(3): 238–242. doi: https://doi.org/10.1115/1.2792628

Abstract

View articletitled, Avionics Passive Cooling With Microencapsulated Phase Change Materials

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Topics: Avionics , Cooling , Phase change materials , Aircraft , Aluminum plate , Design , Heat sinks , Missiles , Weight (Mass)

Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct

A. Gupta, Y. Jaluria

J. Electron. Packag. September 1998, 120(3): 243–252. doi: https://doi.org/10.1115/1.2792629

Abstract

View articletitled, Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct

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Topics: Cooling , Ducts , Heat , Reynolds number , Heat transfer , Water , Algebra , Buoyancy , Flow (Dynamics) , Flow visualization

Random Change of Vibration Modes in Thermosonic Bonding

S.-Y. Kang, K. Chuang, Y. C. Lee

J. Electron. Packag. September 1998, 120(3): 253–258. doi: https://doi.org/10.1115/1.2792630

Abstract

View articletitled, Random Change of Vibration Modes in Thermosonic Bonding

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Topics: Bonding , Vibration , Friction , End effectors , Excitation , Flip-chip assemblies , Generators , Modal analysis , Process control , Resonance

Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages

Y. Kondo, M. Behnia, W. Nakayama, H. Matsushima

J. Electron. Packag. September 1998, 120(3): 259–266. doi: https://doi.org/10.1115/1.2792631

Abstract

View articletitled, Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages

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Topics: Electronic packages , Heat sinks , Impingement cooling , Optimization , Computational fluid dynamics , Design , Cooling , Dimensions , Electronic components , Engineering simulation

Evaluation of Elasto-Plastic Interfacial Fracture Parameters in Solder-Copper Bimaterial Using Moire´ Interferometry

H. Krishnamoorthy, H. V. Tippur

J. Electron. Packag. September 1998, 120(3): 267–274. doi: https://doi.org/10.1115/1.2792632

Abstract

View articletitled, Evaluation of Elasto-Plastic Interfacial Fracture Parameters in Solder-Copper Bimaterial Using Moire´ Interferometry

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Topics: Copper , Fracture (Materials) , Fracture (Process) , Interferometry , Solders , Deformation , Failure , Fracture toughness , Geometry , Strain gages

Applications of Digital Speckle Correlation to Microscopic Strain Measurement and Materials’ Property Characterization

H. Lu

J. Electron. Packag. September 1998, 120(3): 275–279. doi: https://doi.org/10.1115/1.2792633

Abstract

View articletitled, Applications of Digital Speckle Correlation to Microscopic Strain Measurement and Materials’ Property Characterization

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Topics: Hardware , Manufacturing , Reliability , Resolution (Optics) , Strain measurement

The Effects of Material Properties on Heat Dissipation in High Power Electronics

T. J. Lu, A. G. Evans, J. W. Hutchinson

J. Electron. Packag. September 1998, 120(3): 280–289. doi: https://doi.org/10.1115/1.2792634

Abstract

View articletitled, The Effects of Material Properties on Heat Dissipation in High Power Electronics

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Topics: Electronics , Energy dissipation , Heat , Materials properties , Thermal conductivity , Cooling , Approximation , Diamonds , Dimensions , Insulation

Package-to-Board Attach Reliability — Methodology and Case Study on OMPAC Package

B. Nagaraj, M. Mahalingam

J. Electron. Packag. September 1998, 120(3): 290–295. doi: https://doi.org/10.1115/1.2792635

Abstract

View articletitled, Package-to-Board Attach Reliability — Methodology and Case Study on OMPAC Package

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Topics: Reliability , Temperature , Solders , Cycles , Finite element methods , Simulation , Creep , Failure , Simulation results , Ball-Grid-Array packaging

Performance Analysis of Double Stack Cold Plates Covering All Conditions of Asymmetric Heat Loading

R. J. Pieper, A. D. Kraus

J. Electron. Packag. September 1998, 120(3): 296–301. doi: https://doi.org/10.1115/1.2792636

Abstract

View articletitled, Performance Analysis of Double Stack Cold Plates Covering All Conditions of Asymmetric Heat Loading

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Topics: Heat , Plates (structures) , Temperature , Composite materials , Fins , Stress

A Two-Body Formulation for Solder Joint Shape Prediction

F. P. Renken, G. Subbarayan

J. Electron. Packag. September 1998, 120(3): 302–308. doi: https://doi.org/10.1115/1.2792637

Abstract

View articletitled, A Two-Body Formulation for Solder Joint Shape Prediction

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Topics: Shapes , Solder joints , Solders , Drops , Ball-Grid-Array packaging , Ceramics , Design , Fatigue life , Finite element analysis , Flip-chip

Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique

J. Wang, Z. Qian, S. Liu

J. Electron. Packag. September 1998, 120(3): 309–313. doi: https://doi.org/10.1115/1.2792638

Abstract

View articletitled, Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique

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Topics: Flip-chip , Modeling , Packaging , Stress , Manufacturing , Deflection , Finite element analysis , Warping , Alloys , Bonding

Technical Brief

In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive

A. S. Voloshin, P.-H. Tsao, R. A. Pearson

J. Electron. Packag. September 1998, 120(3): 314–318. doi: https://doi.org/10.1115/1.2792639

Abstract

View articletitled, In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive

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Topics: Adhesives , Residual stresses , Epoxy adhesives , Epoxy resins , Stress , Hardening (Curing) , Absorption , Cooling , Interferometry , Relaxation (Physics)

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Technical Papers

Analysis of Bending and Shearing of Tri-Layer Laminations for Solder Joint Reliability

Thermal Enhancement Coatings for Microelectronic Systems

Avionics Passive Cooling With Microencapsulated Phase Change Materials

Forced Convective Liquid Cooling of Arrays of Protruding Heated Elements Mounted in a Rectangular Duct

Random Change of Vibration Modes in Thermosonic Bonding

Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages

Evaluation of Elasto-Plastic Interfacial Fracture Parameters in Solder-Copper Bimaterial Using Moire´ Interferometry

Applications of Digital Speckle Correlation to Microscopic Strain Measurement and Materials’ Property Characterization

The Effects of Material Properties on Heat Dissipation in High Power Electronics

Package-to-Board Attach Reliability — Methodology and Case Study on OMPAC Package

Performance Analysis of Double Stack Cold Plates Covering All Conditions of Asymmetric Heat Loading

A Two-Body Formulation for Solder Joint Shape Prediction

Process Induced Stresses of a Flip-Chip Packaging by Sequential Processing Modeling Technique

Technical Brief

In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive

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