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Issues
March 1990
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Editorial
Research Papers
Structural Analysis For Circuit Card Systems Subjected to Bending
J. Electron. Packag. March 1990, 112(1): 2–10.
doi: https://doi.org/10.1115/1.2904336
Topics:
Circuits
,
Finite element methods
,
Modeling
,
Shapes
,
Stress
,
Strips
,
Structural analysis
Thermomechanical Behavior of Multilayer Structures in Microelectronics
J. Electron. Packag. March 1990, 112(1): 11–15.
doi: https://doi.org/10.1115/1.2904332
Topics:
Deformation
,
Epoxy adhesives
,
Epoxy resins
,
Glass
,
Hardening (Curing)
,
Laminates
,
Lamination
,
Microelectronic devices
,
Polymerization
,
Residual stresses
Realistic Modeling of Edge Effect Stresses in Bimaterial Elements
J. Electron. Packag. March 1990, 112(1): 16–23.
doi: https://doi.org/10.1115/1.2904333
Topics:
Modeling
,
Stress
,
Aluminum
,
Elasticity
,
Strength (Materials)
,
Design
,
Eigenfunctions
,
Electronics
,
Finite element analysis
,
Shear (Mechanics)
Thermal Stresses in Compliantly Joined Materials
J. Electron. Packag. March 1990, 112(1): 24–29.
doi: https://doi.org/10.1115/1.2904335
Topics:
Bonding
,
Finite element analysis
,
Stress
,
Thermal stresses
Deformation in Multilayer Stacked Assemblies
J. Electron. Packag. March 1990, 112(1): 30–34.
doi: https://doi.org/10.1115/1.2904337
Topics:
Deformation
,
Finite element analysis
,
Geometry
,
Manufacturing
,
Polynomials
,
Silicon
,
Solders
,
Stress
,
Temperature controls
,
Transistors
Modeling Thermal Stress Behavior in Microelectronic Components
J. Electron. Packag. March 1990, 112(1): 35–40.
doi: https://doi.org/10.1115/1.2904338
Topics:
Modeling
,
Thermal stresses
,
Stress
,
Failure
,
Mechanical properties
,
Thermal stress cracking
,
Capacitors
,
Ceramics
,
Cracking (Materials)
,
Dimensions
Elasticity Analysis to Aid in Extracting Thin Film Elastic Moduli From Continuous Indentation Data
J. Electron. Packag. March 1990, 112(1): 41–46.
doi: https://doi.org/10.1115/1.2904339
Topics:
Elastic moduli
,
Elasticity
,
Thin films
,
Borosilicate glasses
,
Computers
,
Crystals
,
Engineering simulation
,
Glass
,
Heat resistant glass
,
Simulation
Thermoplastic Problem of a Thick Orthotropic Beam on Two-Directional Elastic Foundation
J. Electron. Packag. March 1990, 112(1): 47–51.
doi: https://doi.org/10.1115/1.2904340
Performance of a Conduction Cooling Module
J. Electron. Packag. March 1990, 112(1): 52–56.
doi: https://doi.org/10.1115/1.2904341
Topics:
Cooling
,
Heat conduction
,
Pistons
,
Coolants
,
Heat transfer coefficients
,
Pressure drop
,
Thermal resistance
Prediction of Surface Temperature and Heat Flux of a Microelectronic Chip With Jet Impingement Cooling
J. Electron. Packag. March 1990, 112(1): 57–62.
doi: https://doi.org/10.1115/1.2904342
Free Convection in a Discretely Heated Vertical Enclosure: Effects of Prandtl Number and Cavity Size
J. Electron. Packag. March 1990, 112(1): 63–74.
doi: https://doi.org/10.1115/1.2904343
Technical Briefs
Mechanical Evaluation of the “Euler” Test Probe
J. Electron. Packag. March 1990, 112(1): 75–77.
doi: https://doi.org/10.1115/1.2904344
Topics:
Probes
,
Wire
,
Stress
,
Buckling
,
Deflection
,
Design
,
Mechanical behavior
Thermal Stress CAD Analysis of a Multi-Layer Composite of an Operating Transistor Package
J. Electron. Packag. March 1990, 112(1): 77–80.
doi: https://doi.org/10.1115/1.2904345
Thermally Induced Failure of Microelectronic Structures
J. Electron. Packag. March 1990, 112(1): 80–82.
doi: https://doi.org/10.1115/1.2904346
Topics:
Failure
,
Stress
,
Temperature
,
Temperature gradient
,
Yield strength
,
Cooling
,
Flow (Dynamics)
,
Fluids
,
Mechanical properties
,
Silicon chips
How Long Should Be a Beam Specimen in Bending Tests?
J. Electron. Packag. March 1990, 112(1): 83–85.
doi: https://doi.org/10.1115/1.2904347
Topics:
Deflection
,
Glass
,
Shear (Mechanics)
,
Stress
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