This study details the fabrication and measurements of a water-filled 5 mm wide by 10 mm long silicon microheat pipe (MHP) array consisting of square channels. This study is unique in that many experimental results reported in open literature are for single channel microheat pipes. The number of channels in the array and the fluid charge used here were optimized under a separate study. A number of experiments were carried out on the specimen MHPs to determine their effective thermal conductivity and comparisons were made with previous results found in literature. The testing methodology was designed to remove systematic biases and the array thermal performance measurements are reported in terms of a silicon equivalence by identically measuring an uncharged empty silicon array as a baseline measurement. Two separate water-filled specimens were made, independently tested, and are reported to have thermal conductivities of and , representing a silicon equivalence of 1.8 and 2.2, respectively. All testing was performed in a horizontal orientation.
Skip Nav Destination
e-mail: harridk@auburn.edu
e-mail: gwonacott@sdcomposites.com
e-mail: deanron@auburn.edu
e-mail: florentina.simionescu@wgint.com
Article navigation
June 2010
Research Papers
An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays
D. K. Harris,
D. K. Harris
Associate Professor
Department of Mechanical Engineering, 250 Ross Hall,
e-mail: harridk@auburn.edu
Auburn University
, Auburn, AL 36849
Search for other works by this author on:
G. Wonacott,
e-mail: gwonacott@sdcomposites.com
G. Wonacott
CEO
San Diego Composites, Inc.
, 9550 Ridgehaven Court, San Diego, CA 92123
Search for other works by this author on:
R. Dean,
R. Dean
Assistant Professor
Department of Electrical and Computer Engineering, 200 Broun Hall,
e-mail: deanron@auburn.edu
Auburn University
, Auburn, AL 36849
Search for other works by this author on:
F. Simionescu
e-mail: florentina.simionescu@wgint.com
F. Simionescu
Engineer
URS Corporation-Washington Division
, 2 Perimeter Park South, Birmingham, AL 35243
Search for other works by this author on:
D. K. Harris
Associate Professor
Department of Mechanical Engineering, 250 Ross Hall,
Auburn University
, Auburn, AL 36849e-mail: harridk@auburn.edu
A. Palkar
Plant Maintenance Leader
G. Wonacott
CEO
San Diego Composites, Inc.
, 9550 Ridgehaven Court, San Diego, CA 92123e-mail: gwonacott@sdcomposites.com
R. Dean
Assistant Professor
Department of Electrical and Computer Engineering, 200 Broun Hall,
Auburn University
, Auburn, AL 36849e-mail: deanron@auburn.edu
F. Simionescu
Engineer
URS Corporation-Washington Division
, 2 Perimeter Park South, Birmingham, AL 35243e-mail: florentina.simionescu@wgint.com
J. Electron. Packag. Jun 2010, 132(2): 021005 (8 pages)
Published Online: June 23, 2010
Article history
Received:
October 9, 2009
Revised:
March 26, 2010
Online:
June 23, 2010
Published:
June 23, 2010
Citation
Harris, D. K., Palkar, A., Wonacott, G., Dean, R., and Simionescu, F. (June 23, 2010). "An Experimental Investigation in the Performance of Water-Filled Silicon Microheat Pipe Arrays." ASME. J. Electron. Packag. June 2010; 132(2): 021005. https://doi.org/10.1115/1.4001745
Download citation file:
Get Email Alerts
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag (December 2024)
Related Articles
A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology
J. Electron. Packag (September,2003)
3-Omega Measurements of Vertically Oriented Carbon Nanotubes on Silicon
J. Heat Transfer (November,2006)
Device Process Integration: A New Device Fabrication Approach
J. Med. Devices (June,2010)
Simulation of Interfacial Phonon Transport in Si–Ge Heterostructures Using an Atomistic Green’s Function Method
J. Heat Transfer (April,2007)
Related Proceedings Papers
Related Chapters
Resistance Mythology
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Discussion of Heat Flow Meter Apparatus and Transfer Standards Used for Error Analysis
Guarded Hot Plate and Heat Flow Meter Methodology
A Wall and Edge Guarded Hot Box for Thermal Transmittance Measurements
Insulation Materials: Testing and Applications, 3rd Volume