An analytical model is developed to estimate the heat transfer performance of printed circuit board (PCBs). The PCB under study is the substrate for a ball-grid-array (BGA) package. Under the BGA, the PCB has a belt of densely populated through-vias that penetrate the laminate of horizontal copper and resin; outside the BGA-covered area the board is a copper/resin laminate and its surfaces are exposed to cooling air. Calculations are performed on a sample board having the dimensions (thickness). The model of the board has two internal layers of continuous copper (0.03 mm thick) and through-vias under a BGA package. The impacts of board design parameters on the temperature and the heat flow are presented; the parameters are the width of the insulation gap around the via, the area of copper coverage at the via bottom, and the population of vias.
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December 2008
Thermal Issues In Emerging Technologies Theory And Applications, Theta
Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach
Wataru Nakayama
e-mail: watnakayama@aol.com
Wataru Nakayama
ThermTech International
, 920-7 Higashi Kosio, Oh-Iso, Kanagawa 255-0004, Japan
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Wataru Nakayama
ThermTech International
, 920-7 Higashi Kosio, Oh-Iso, Kanagawa 255-0004, Japane-mail: watnakayama@aol.com
J. Electron. Packag. Dec 2008, 130(4): 041106 (10 pages)
Published Online: November 14, 2008
Article history
Revised:
June 3, 2008
Received:
September 18, 2008
Published:
November 14, 2008
Citation
Nakayama, W. (November 14, 2008). "Heat Conduction in Printed Circuit Boards: A Mesoscale Modeling Approach." ASME. J. Electron. Packag. December 2008; 130(4): 041106. https://doi.org/10.1115/1.2993126
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