Double stack, force-cooled cold plates, which are used as electronic chassis, are investigated for all conditions of unequal temperature and heat loading. A closed form solution that relates the plate temperatures to composite heat loads is derived. This analysis covers all regimes of operation. In particular, this includes the previously ignored regime in which no adiabatic point exists anywhere on either of the fins connecting cover and splitter plates. The heat dissipating advantage of the double stack structure, over a similarly designed single stack structure, is predicted with the analysis presented in the paper.

Issue Section:
Technical Papers
Topics:
Heat, Plates (structures), Temperature, Composite materials, Fins, Stress
1.
Gardner
 
K. A.
,
1945
, “
Efficiency of Extended Surface
,”
Trans. ASME
, Vol.
67
, pp.
621
621
.
2.
Horowitz, P., and Hill, W., 1981, “The Art of Electronics,” chap. 5 in Voltage Regulators and Power Circuits, Cambridge University Press, Cambridge, UK.
3.
Kays
 
W. M.
,
1960
, “
Basic Heat Transfer and Flow Friction Characteristics of Six High Performance Heat Transfer Surfaces
,”
J. Eng. Power
, Vol.
82
, p.
27
27
.
4.
Kays, W. M., and London, A. L., 1984, Compact Heat Exchangers, 3rd ed., McGraw-Hill Book Co., NY.
5.
Kern, D. Q., and Kraus, A. D., 1972, Extended Surface Heat Transfer, McGraw-Hill Book Co., NY.
6.
Kraus, A. D., 1960, “Efficiency of the Finned Annular Passages,” ASME Paper 60-HT-3, 4th ASME-AIChE Heat Transfer Conf.
7.
Kraus, A. D., 1961, “Efficiency of the Cold Plate Heat Exchanger,” Proc. Natl. Aeronaut Electron Conf., p. 381.
8.
Kraus, A. D., 1962, “Optimization of the Cold Plate Heat Exchanger,” Proc. Natl. Aeronaut Electron Conf., p. 78.
9.
Kraus, A. D., 1982, Analysis and Evaluation of Extended Surface Thermal Systems, Hemisphere Publishing Co., NY.
10.
Kraus, A. D., and Pieper, R. J., 1995, “Cold Plates with Asymmetric Heat Loading, Part II—The Double Slack,” Advances in Electronic Packaging, EEP-10-2, ASME, NY, pp. 871–878.
11.
Kraus
 
A. D.
,
Snider
 
A. D.
, and
Doty
 
L. F.
,
1978
, “
An Efficient Algorithm for Evaluating Arrays of Extended Surface
,”
ASME Journal of Heat Transfer
, Vol.
100
, p.
288
288
.
12.
MACSYMA, 1991, Symbolics, Inc., East Burlington, MA, 01803.
13.
Murray
 
W. M.
,
1938
, “
Heat Transfer Through an Annular Disk or Fin of Uniform Thickness
,”
ASME Journal of Applied Mechanics
, Vol.
60
, p.
A78
A78
.
14.
Pieper, R. J., and Kraus, A. D., 1995, “Cold Plates With Asymmetric Heat Loading, Part I—The Single Stack,” Advances in Electronic Packaging, EEP-10-2, ASME, NY, pp. 865–870.
15.
Pieper, R. J., and Kraus, A. D., 1996, “Cold Plates With Asymmetric Heat Loading,” International Journal of μ-Electronic Packaging, in press.
16.
PSPICE, 1996, Version 7.1, MicroSim Corp., Irving, CA.
17.
Smith, R. K., 1966, personal communication.
18.
Snider
 
A. D.
, and
Kraus
 
A. D.
,
1981
, “
A General Extended Surface Analysis Method
,”
ASME Journal of Heat Transfer
, Vol.
103
, p.
699
699
.
This content is only available via PDF.
Copyright © 1998
 by The American Society of Mechanical Engineers
You do not currently have access to this content.