The determination of stress in a typical module/lead/card system is generally a very complex task. In the present paper a new engineering modeling approach is given, high-lighting simple, approximate calculations of the most significant system responses. Simplified patterns of plate action are construed using strips, including the module, in both x and y directions. Relationships were obtained for various shapes and sizes of card and module (e.g., square and rectangular); various systems of load and support conditions; various designs of modules (e.g., double-sided and stacked) and leads; clustered groups of modules, etc. The finite element method was used both to corroborate results of the theoretical approach, and to provide an “experimental” technique for the major response quantities.
Skip Nav Destination
Article navigation
March 1990
Research Papers
Structural Analysis For Circuit Card Systems Subjected to Bending
P. A. Engel
P. A. Engel
Department of Mechanical and Industrial Engineering, SUNY Binghamton, Binghamton, NY 13901
Search for other works by this author on:
P. A. Engel
Department of Mechanical and Industrial Engineering, SUNY Binghamton, Binghamton, NY 13901
J. Electron. Packag. Mar 1990, 112(1): 2-10 (9 pages)
Published Online: March 1, 1990
Article history
Received:
December 27, 1989
Online:
April 28, 2008
Citation
Engel, P. A. (March 1, 1990). "Structural Analysis For Circuit Card Systems Subjected to Bending." ASME. J. Electron. Packag. March 1990; 112(1): 2–10. https://doi.org/10.1115/1.2904336
Download citation file:
Get Email Alerts
Cited By
Optimization of Micropillars Electroplating Bonding Processes and Additives
J. Electron. Packag (June 2025)
Microbead Encapsulation for Protection of Electronic Components
J. Electron. Packag (June 2025)
Related Articles
Harmonic Convergence Estimation Through Strain Energy Superconvergence
J. Eng. Gas Turbines Power (October,2016)
DeepJEB: 3D Deep Learning-Based Synthetic Jet Engine Bracket Dataset
J. Mech. Des (April,2025)
Modeling the Rolling of Ribbed Strip by a 3D Rigid Viscoplastic FEM
J. Manuf. Sci. Eng (May,2005)
Approximate Structural Analysis of Circuit Card Systems Subjected to Torsion
J. Electron. Packag (June,1992)
Related Proceedings Papers
Related Chapters
Introduction to Contact Problems in Structural Mechanics
Contact in Structural Mechanics: A Weighted Residual Approach
Approximate Analysis of Plates
Design of Plate and Shell Structures
Conclusion
Introduction to Finite Element, Boundary Element, and Meshless Methods: With Applications to Heat Transfer and Fluid Flow