Research Papers

Piezoelectric Damping of Resistively Shunted Beams and Optimal Parameters for Maximum Damping

[+] Author and Article Information
Yabin Liao1

School of Mechanical, Aerospace, Chemical and Materials Engineering, Arizona State University, Tempe, AZ 85287-6106yabin.liao@asu.edu

Henry A. Sodano

School of Mechanical, Aerospace, Chemical and Materials Engineering, Arizona State University, Tempe, AZ 85287-6106


Corresponding author.

J. Vib. Acoust 132(4), 041014 (Jul 15, 2010) (7 pages) doi:10.1115/1.4001505 History: Received May 27, 2009; Revised March 23, 2010; Published July 15, 2010; Online July 15, 2010

This paper studies the piezoelectric damping of resistively shunted beams induced by the conversion of the vibration energy into electrical energy that is dissipated in the resistor through Joule heating. Significant contributions have been made in the modeling and development of the resistive shunt damping technique; however, many approaches involve complex models that require the use of numerical methods to determine system parameters and predict damping. This paper develops a closed-form solution for the optimal parameter of a resistive shunt damping system. The model is validated through experimental testing and provides a simple yet accurate method to predict the induced damping in a smart structure.

Copyright © 2010 by American Society of Mechanical Engineers
Topics: Damping , Modeling
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Figure 1

Schematic of a bimorph composite beam

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Figure 2

Experimental setup for shunt damping measurements

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Figure 3

Measured first-mode natural frequency f versus shunt resistance R

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Figure 4

Measured first-mode damping ratio ζ versus shunt resistance R

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Figure 5

Loss factor η versus shunt resistance R. ●, predicted by Eq. 16; ◻, measured.

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Figure 6

Loss factor η versus nondimensional frequency RCpω (or rλ). —, predicted by Eq. 14; ◻, measured.

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Figure 7

Optimal thickness ratio versus modulus ratio. Obtained from Eq. 28.

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Figure 8

Maximum tunable loss factor versus thickness ratio. Obtained from Eq. 18.



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