Focus on solving the increasing heat fluxes in the electronic industry, vapor chamber shows its excellent characteristic as an effective heat spreading device. A serial of vapor chambers made of copper-water and using mesh as the wick material had been manufactured in this paper. The dimension of the vapor chambers are all 95mm*70mm*3.2mm. A remote method was used to test the performance of the vapor chambers, where the property of evaporation and vapor transportation will be mainly studied. Results show that the adiabatic resistance (vapor transportation) can be less than 0.05°C/W at high heat flux, which means the temperature is almost uniform on the top wall of the vapor chamber. The evaporation heat transfer coefficient could be higher than 20000W/m2K. But compared with the small size of heated zone, the evaporation thermal resistant might be still the largest one in the vapor chambers. The orientations have no obviously effect on the performance of the vapor chamber. As the vapor chamber is small, the gravity effect is not obvious here. The flatness of the mesh may become worse during the operation. To solve this problem, at least two ways can be performed. One is to use some support to keep the mesh attached closed to the wall, and the other is to use the diffusion banding. Finally, we use the experiment data to estimate the thermal resistance of vapor chamber as a heat sink base, and compare with the solid copper to see the potential opportunity to use the vapor chamber.

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