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  • Proceedings Article January 01, 2003

    Xiaoqing Wang; Fouad Kiamilev; George Papen; Jeremy Ekman; Ping Gui; Mike Haney; Joseph Deroba; Michael McFadden; Charles Kuznia

    Proc. ASME. 36908a; 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1:629-637.January 01, 2003
    IPACK2003-35111
    doi: 10.1115/IPACK2003-35111

    TOPICS: Packaging