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  • Proceedings Article January 01, 2003

    Triem T. Hoang; Tamara A. O’Connell; Jentung Ku; C. Dan Butler; Theodore D. Swanson

    Proc. ASME. 36908b; 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2:517-525.January 01, 2003
    IPACK2003-35245
    doi: 10.1115/IPACK2003-35245