A Hermite Spline Layerwise Time Domain Spectral Finite Element for Guided Wave Prediction in Laminated Composite and Sandwich Plates

[+] Author and Article Information
C. S. Rekatsinas

Dept. of Mechanical Engineering & Aeronautics, University of Patras, GR-26500, Rion-Patras, Greece

D. A. Saravanos

Dept. of Mechanical Engineering & Aeronautics, University of Patras, GR-26500, Rion-Patras, Greece

1Corresponding author.

ASME doi:10.1115/1.4035702 History: Received August 07, 2016; Revised December 20, 2016


A new time domain spectral plate finite element is developed to provide fast numerical calculations of guided waves and transient phenomena in laminated composite and sandwich plates. A new multi-field layerwise laminate theory provides the basis for the finite element, which incorporates cubic Hermite polynomial splines for the approximation of the in-plane and transverse displacement fields through the thickness of the plate, enabling the modelling of symmetric and anti-symmetric wave modes. The time domain spectral finite element with multiple degrees of freedom per node is subsequently formulated, which uses integration points collocated with the nodes to yield consistent diagonal lumped mass matrix which expedites the explicit time integration process. Numerical simulations of wave propagation in aluminum, laminated carbon/epoxy and thick sandwich plates are presented and validated with an analytical solution and a three-dimensional solid element; moreover, the capability to accurately and rapidly predict anti-symmetric and symmetric guided waves is demonstrated.

Copyright (c) 2017 by ASME
Your Session has timed out. Please sign back in to continue.






Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In